Electronic Component-Incorporating Substrate Recess Design
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Solution Overview
Problem
Thin film electronic components, such as capacitors, face deformation risks due to external forces when integrated into substrates, as they have lower rigidity compared to chip capacitors, posing a challenge in handling and durability.
Innovation Solution
An electronic component-incorporating substrate design featuring a first and second insulating layer with a conductor layer, where the electronic component is stacked with electrode layers and a dielectric layer, and its height position is differentiated from the conductor layer's height, allowing external forces to propagate along the conductor layer without affecting the component, and an adhesive layer can be used to further mitigate these forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thin film electronic component is incorporated in the substrate to achieve miniaturization, then the profile and size are reduced, but the component has lower rigidity and is susceptible to deformation from external forces
Solution Approach 1:
The patent introduces a recess structure in the substrate that acts as an intermediary between the thin film component and the external environment. This recess provides mechanical support and isolation to the component, protecting it from external forces while maintaining the miniaturized profile. The recess serves as a mediator that decouples the component from direct exposure to bending forces and handling stresses.
2Device complexity
If the electronic component height position is aligned with the conductor layer to simplify structure, then manufacturing is easier, but external forces propagating along the conductor layer directly affect the component
Solution Approach 1:
The patent addresses the force propagation issue by introducing a vertical dimension solution - creating a recess that changes the height position of the component relative to the conductor layer. This dimensional change allows the component to be positioned at a different height level, interrupting the direct transmission path of external forces along the conductor layer while maintaining planar integration.
3Length of stationary object
If the substrate profile is reduced to meet miniaturization demands, then the overall size is smaller, but the substrate becomes more susceptible to bending and external forces
Solution Approach 1:
The patent segments the substrate structure by creating a localized recess region that is distinct from the main substrate body. This segmentation allows the thin substrate profile to be maintained in most areas while providing enhanced mechanical support specifically where the electronic component is located. The recess creates a stepped structure that isolates the component from bending forces without requiring overall substrate thickening.
Data Source
AI summary
A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.