Substrate Recess Processing to Suppress Chamber Repolymerization
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Solution Overview
Problem
Existing substrate processing methods face challenges in improving productivity due to the accumulation of repolymerized products on chamber surfaces, leading to particle generation and reduced yield, which conventional thermal and dry cleaning methods cannot effectively address without compromising efficiency.
Innovation Solution
A substrate processing method involving the thermal decomposition of a polymer material with a urea bond, followed by the use of hydrogen or halogen-based gas plasma to decompose and gasify reactive monomers generated during depolymerization, while controlling the flow rate of active species to prevent damage to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal cleaning or dry cleaning methods are used to remove repolymerized products, then chamber surfaces can be cleaned, but productivity is reduced and particle generation occurs
Solution Approach 1:
The patent converts the harmful repolymerized products into beneficial volatile monomers through controlled thermal decomposition. By heating the chamber to decompose polymer materials and using plasma to further break down the monomers into volatile components, the harmful deposits are transformed into removable vapor-phase substances, eliminating the need for conventional cleaning methods that reduce productivity
Solution Approach 2:
The patent changes the physical and chemical parameters of the repolymerized products by controlling temperature and plasma conditions. Through parameter optimization, the decomposition temperature is set to break down polymer materials into monomers, and plasma parameters are adjusted to further decompose monomers into volatile substances that can be easily removed without affecting productivity
2Manufacturing precision
If polymer material is thermally decomposed to remove it from recesses, then air gaps can be formed, but repolymerization occurs on chamber surfaces causing particle generation
Solution Approach 1:
The patent extracts the problematic monomers from the chamber environment by using plasma to decompose them into volatile substances. The plasma treatment removes monomers that would otherwise repolymerize on chamber surfaces, extracting the harmful component before it can cause particle generation while preserving the desired air gap formation
Solution Approach 2:
The patent introduces plasma as an intermediary substance to mediate between the thermal decomposition process and the chamber environment. The plasma acts as a mediator that converts monomers into volatile products, preventing direct repolymerization on chamber surfaces while allowing the air gap formation process to proceed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach suppresses repolymerization, reduces the need for periodic dry cleaning, enhances productivity, and minimizes particle generation, thereby improving yield and reducing substrate damage.
Implementation Method 1
heating the substrate to a temperature at which the polymer material is thermally decomposed to decompose the polymer material by depolymerization
Implementation Method 2
supplying a processing gas containing hydrogen, oxygen, or a halogen-based gas to decompose and gasify the reactive monomer generated by the depolymerization by active species contained in the plasma of the processing gas
Data Source
AI summary
A substrate processing method is provided. The method comprises: (a) providing a substrate having a recess in which a polymer material having a urea bond is embedded by a vapor deposition polymerization reaction of a first monomer and a second monomer; and (b) heating the substrate to a temperature at which the polymer material is thermally decomposed to decompose the polymer material by depolymerization, wherein said (b) includes supplying a processing gas containing hydrogen, oxygen, or a halogen-based gas to decompose and gasify the reactive monomer generated by the depolymerization by active species contained in the plasma of the processing gas.