Substrate Recess Processing With Selective Termination Removal
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Solution Overview
Problem
Existing methods struggle to selectively process different surfaces within the recesses of a substrate during semiconductor device manufacturing, particularly in selectively removing and forming films on specific terminations within these recesses.
Innovation Solution
A substrate processing method involving the use of a processing solution that reacts with a first termination while reducing its surface tension, allowing selective removal and subsequent film formation on a second termination, using a substrate processing apparatus with integrated film-forming and cleaning capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional processing methods are used on substrates with recesses, then the processing solution can access the recess surfaces, but selective processing of different terminations within the recess is not achieved
Solution Approach 1:
The patent applies local quality by creating different termination conditions at different locations within the recess structure. The first termination is formed at the bottom surface and sidewalls through selective exposure to processing solutions, while the second termination is formed at the opening surface. This spatial differentiation of termination types enables selective processing of different surfaces within the recess, resolving the contradiction between achieving selective processing precision and maintaining processing solution accessibility.
2Manufacturing precision
If the processing solution is designed to react with specific terminations, then selective removal is achieved, but the complexity of the processing solution increases
Solution Approach 1:
The patent segments the processing into distinct stages with different processing solutions tailored for specific termination types. First, a processing solution is used to create the initial termination distribution, then subsequent processing solutions are applied to selectively remove or modify specific terminations. This segmentation of the processing sequence allows each solution to be optimized for its specific function, achieving high selective removal precision without requiring a single overly complex processing solution.
3Manufacturing precision
If multiple processing steps are used to create different terminations, then selective processing capability is improved, but the manufacturing time increases
Solution Approach 1:
The patent employs periodic action through cyclic processing sequences where substrates are repeatedly exposed to processing solutions under controlled conditions. The processing follows a periodic pattern of exposure, rinsing, and drying steps that efficiently create and differentiate terminations. This periodic processing approach achieves high termination differentiation precision while minimizing total processing time by optimizing the duration and frequency of each processing cycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables selective processing of substrate surfaces within recesses, enhancing the precision and efficiency of semiconductor device manufacturing by preferentially treating specific surface terminations.
Implementation Method 1
a liquid that reacts with the first termination
Implementation Method 2
an additive that reduces surface tension of the liquid
Data Source
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AI summary
There is provided a technique that includes (a) preparing a substrate (200) including a first surface, which includes a first termination and constitutes at least a portion of an inner surface of a recess, and a second surface, which includes a second termination different from the first termination, and (b) removing the first termination selectively with respect to the second termination by exposing the substrate (200) to a processing solution containing a liquid that reacts with the first termination and an additive that reduces surface tension of the liquid.