Electronic Component Substrate With Recessed Mount Portion
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Solution Overview
Problem
The connection reliability between an electronic component and via wiring in a wiring substrate is compromised due to displacement of the electronic component, which affects the reliability of the terminal connection.
Innovation Solution
An electronic component-incorporating substrate design featuring a mount portion with a recessed first accommodation portion and a larger second accommodation portion, where the electronic component is mounted on the first portion and covered by a second insulation layer, with via wiring extending through to connect the component's connection pad, limiting displacement and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component is mounted in a cavity without additional constraints, then the mounting process is simple, but the connection reliability deteriorates due to component displacement
Solution Approach 1:
The accommodation portion is divided into two distinct parts: a first accommodation portion (cavity) for receiving the electronic component, and a second accommodation portion (protrusion) for providing mechanical constraint. This segmentation allows each part to fulfill its specific function - the cavity for component placement and the protrusion for displacement prevention - thereby resolving the contradiction between simple mounting and reliable connection.
Solution Approach 2:
The mount portion acts as an intermediary structure between the substrate and the electronic component. It includes a protrusion that extends into the cavity to physically constrain the component's position. This intermediary mechanism enables reliable electrical connections by preventing component displacement while maintaining a relatively simple overall mounting structure.
2Reliability
If the electronic component is allowed to move freely on the substrate, then the ease of operation is high, but the connection reliability deteriorates due to displacement
Solution Approach 1:
The mount portion structure with its protrusion into the cavity is prepared in advance during substrate manufacturing. This preliminary structural arrangement automatically constrains the electronic component's position once mounted, eliminating the need for additional positioning operations while ensuring reliable terminal connections. The constraint mechanism is built-in rather than added later.
3Ease of manufacture
If a simple cavity structure is used for mounting, then the manufacturing process is simple, but the electronic component may rotate or displace affecting connection reliability
Solution Approach 1:
The cavity structure is segmented into a first accommodation portion for component reception and a second accommodation portion (protrusion) for mechanical constraint. This segmentation can be achieved through standard PCB manufacturing techniques like selective plating or molding, maintaining ease of manufacture while adding the necessary constraint function to prevent rotation and displacement.
Solution Approach 2:
The mount portion has different structural properties at different locations: the cavity provides a recessed mounting area while the protrusion provides a localized constraint feature. This local differentiation of structural quality allows the same mount portion to provide both simple component reception and reliable positional constraint, resolving the contradiction between manufacturing simplicity and connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate design effectively restricts movement and rotation of the electronic component, thereby maintaining connection reliability and preventing damage, ensuring stable and reliable electrical connections.
Implementation Method 1
forming an opening in the first insulation layer by irradiating an upper surface of the first insulation layer with a laser beam
Implementation Method 2
forming a first accommodation portion recessed from the upper surface of the mount portion by irradiating the upper surface of the mount portion exposed in the opening of the first insulation layer with a laser beam
Data Source
AI summary
An electronic component-incorporating substrate includes a metal mount portion and a first insulation layer. The mount portion includes a first accommodation portion recessed from the upper surface. The first insulation layer includes a second accommodation portion configured by an opening that exposes the first accommodation portion and partially exposes the upper surface of the mount portion located around the first accommodation portion. The electronic component-incorporating substrate further includes an electronic component mounted on the first accommodation portion and including a connection pad, a second insulation layer covering the first insulation layer, the electronic component, and the connection pad, a wiring layer formed on an upper surface of the second insulation layer and including a via wiring extending through the second insulation layer in a thickness-wise direction and a wiring pattern connected to the connection pad of the electronic component by the via wiring.