Substrate Treatment Recipe Validation for Uniform Coverage

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Solution Overview

Problem

Existing substrate treating methods lack a standardized approach to verify the correctness of recipes, leading to potential untreated regions during substrate treatment, especially in single wafer-type processes, which can result in inconsistent treatment times and quality issues.

Innovation Solution

A method that validates the initial recipe by partitioning the substrate into unit regions, checking treatment times, and determining appropriateness through simulation, with modifications if necessary, to ensure uniform treatment across the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a recipe is created and modified by human experience for substrate treatment, then the treatment process can be performed, but there is no standard to determine in advance whether the recipe is written correctly, leading to potential untreated regions

Engineering Contradiction:
Improverecipe correctnessVSAvoidvalidation system
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by validating the recipe through simulation before actual substrate treatment. The system divides the substrate into unit regions, calculates treatment times for each region based on the recipe parameters, and verifies whether all regions receive adequate treatment. This pre-validation prevents incorrect recipes from being executed on actual substrates, ensuring reliability without requiring complex hardware modifications.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses copying by creating a virtual model of the substrate treatment process through simulation. Instead of physically testing recipes on actual substrates, the system creates a digital copy (simulation model) that replicates the treatment dynamics, allowing verification of recipe correctness in a virtual environment before real-world application.

Inventive Principle:
Principle #26Copying

2Productivity

If the rotation of the substrate and the movement of the arm occur simultaneously during treatment, then the treatment can be performed efficiently, but when an incorrect recipe is written, certain regions may be left untreated

Engineering Contradiction:
Improvetreatment efficiencyVSAvoidtreatment uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies segmentation by dividing the substrate into multiple unit regions and calculating the treatment time for each region separately. This allows the system to track and verify that every specific region receives the required treatment duration, ensuring uniformity even when the substrate rotates and the arm moves simultaneously during the treatment process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements feedback by calculating and verifying treatment times for each unit region based on the recipe parameters, substrate rotation speed, and arm movement characteristics. The system provides feedback information about whether the recipe ensures adequate treatment of all regions, allowing for recipe optimization to maintain both productivity and precision.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures consistent and uniform treatment of substrates by validating recipes before application, preventing recipe errors and enhancing treatment efficiency and quality.

Implementation Method 1

the rotation of the substrate and the movement of the arm occur simultaneously

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS20250214123A1Method of treating substrate
Publication Date: 2025.07.03 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US20250214123A1 patent drawing
  • US20250214123A1 patent drawing
  • US20250214123A1 patent drawing

AI summary

Disclosed is a method of treating a substrate, the method including: a substrate treating operation of treating a substrate with a component for treatment while moving an arm mounted with the component for treatment on the substrate rotating in accordance with a treatment recipe relative to the substrate; and a validating operation of validating an initial recipe received for use in the substrate treating operation prior to the substrate treating operation, in which the validating operation includes: a checking operation of partitioning a region on the substrate into a plurality of unit regions, and checking a treatment time during which each of the plurality of unit regions is directly treated by the component for treatment for a set time; and a determining operation of determining whether the treatment time in each of the plurality of unit regions checked in the checking operation is appropriate.