Substrate Reference Patterns for Cavity Alignment
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Solution Overview
Problem
The challenge in manufacturing substrates with built-in components is the low positional accuracy of cavities formed by laser processing, which leads to misalignment of electronic components, necessitating complex alignment mark measurements to ensure accurate positioning.
Innovation Solution
Incorporating reference patterns on the wiring layers that cross the side surfaces of both the electronic components and cavities, allowing for easy verification of positional accuracy through slits and V-shaped patterns, facilitating precise alignment and mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser processing is used to form cavities, then manufacturing flexibility is improved, but positional accuracy deteriorates
Solution Approach 1:
The patent introduces reference patterns as an intermediary element between the laser processing system and the final cavity structure. These patterns serve as mediators that enable alignment verification, allowing the laser processing to maintain its manufacturing flexibility while achieving improved positional accuracy through the reference framework provided by the patterns.
2Manufacturing precision
If photolithography is used to form wiring patterns, then positional accuracy is improved, but device complexity increases
Solution Approach 1:
The patent extracts the alignment verification function from the complex measurement process and embeds it directly into the wiring layer through reference patterns. By taking out the alignment marks and integrating them into the wiring structure itself, the patent eliminates the need for separate alignment mark measurements, thereby reducing device complexity while maintaining high positional accuracy.
3Measurement precision
If alignment marks are measured after component mounting, then positional accuracy verification is achieved, but manufacturing time increases
Solution Approach 1:
The patent implements preliminary action by forming reference patterns during the wiring layer fabrication process, before component mounting occurs. This allows the alignment verification framework to be established in advance, enabling quick and easy positional accuracy checks after component mounting without requiring complex post-assembly measurement procedures, thereby reducing manufacturing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables straightforward and accurate verification of the positional relationship between the cavity and electronic components, enhancing manufacturing efficiency and reducing errors in alignment.
Implementation Method 1
a cavity is formed by irradiating an insulating layer with laser light using a laser processor
Data Source
AI summary
A substrate with built-in component includes: a first wiring layer having at least one reference pattern; a first insulating layer formed on the first wiring layer; and an electronic component mounted, in a cavity formed in the first insulating layer, on the first wiring layer, wherein the at least one reference pattern includes at least one first portion crossing a side surface of the electronic component in plan view, and at least one second portion crossing a side surface of the cavity in plan view.