Semiconductor Package Substrate Reinforcing Member Design

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Solution Overview

Problem

The reduction in thickness of semiconductor package substrates leads to reduced rigidity, causing shape distortions and deformations, which existing technologies fail to effectively prevent or minimize.

Innovation Solution

Incorporating a reinforcing member with a higher hardness material than the insulation layer, disposed between the dummy pattern and the insulation layer, and forming deflection preventing grooves in the reinforcing member to enhance the substrate's structural integrity, thereby preventing shape deformations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the thickness of the substrate is reduced, then the size of the semiconductor package is reduced, but the rigidity of the substrate is reduced and shape distortions occur

Engineering Contradiction:

Improvesize of semiconductor packageVSAvoidrigidity of substrate

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The substrate is divided into a first region (active area with chip mount regions) and a second region (peripheral area). The reinforcing member is specifically disposed in the second region to provide localized support without interfering with chip mounting operations in the first region.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are given different properties. The second region (periphery) is enhanced with a reinforcing member having higher hardness than the insulation layer, while the first region maintains its original structure for chip mounting functionality.

Inventive Principle:

Principle #3Local quality

2Volume of moving object

If the thickness of the substrate is reduced, then the size of the semiconductor package is reduced, but the substrate becomes prone to shape distortions

Engineering Contradiction:

Improvesize of semiconductor packageVSAvoidshape stability of substrate

Core Design Contradiction:

Volume of moving objectVSShape

Solution Approach 1:

The substrate structure is segmented into functional regions, with the reinforcing member confined to the peripheral second region. This segmentation allows the center first region to remain thin for small package size while the periphery gains enhanced shape stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate employs a composite structure combining the base substrate material with a reinforcing member made of different material having higher hardness. This composite approach maintains overall package compactness while providing localized shape stability enhancement.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS8024857B2Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same

Publication Date: 2011.09.27 SK HYNIX INC

AI summary

A substrate for a semiconductor package having a reinforcing member that prevents or minimizes distortions is presented. The substrate for the semiconductor package includes a substrate body, an insulation layer, and a reinforcing member. The substrate body has a first region having a plurality of chip mount regions, a second region disposed along a periphery of the first region, a circuit pattern disposed in each chip mount region and a dummy pattern disposed along the second region. The insulation layer covers the first and second regions and has an opening exposing some portion of each circuit pattern. The reinforcing member is disposed in the second region and prevents deflection of the substrate body.