Electronic Component Built-in Substrate Resin Filling
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Solution Overview
Problem
Existing electronic component built-in substrate manufacturing processes face challenges in reliably filling resin around components due to thickness mismatches between core substrates and components, leading to potential component peeling and inclination, as well as difficulties in forming reliable electrical connections.
Innovation Solution
The method involves forming an electronic component built-in substrate with a core member thickness equal to the component, using auxiliary insulating layers to fill resin with a weak pressing force, and forming thick wiring layers to protect connection terminals during laser processing, ensuring reliable resin filling and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the core substrate thickness is made greater than the electronic component thickness, then the core substrate provides sufficient structural support and space for wiring, but a large space needs to be filled with resin requiring strong pressing force which causes component peeling and inclination
Solution Approach 1:
The substrate is segmented into a core substrate and auxiliary insulating layers. The core substrate provides structural support while the auxiliary insulating layers fill the remaining space and provide additional structural support where needed, eliminating the need for strong pressing force that causes component peeling.
Solution Approach 2:
Auxiliary insulating layers are introduced as intermediary structures between the core substrate and the electronic component. These layers fill the space created by the thickness difference, providing both structural support and a compliant interface that prevents component peeling during resin filling.
2Strength
If the core substrate thickness is made greater than the electronic component thickness, then the core substrate provides sufficient structural support, but it becomes difficult to fill the space around the electronic component with resin with high reliability
Solution Approach 1:
The substrate structure is segmented into a core substrate and auxiliary insulating layers. The auxiliary insulating layers are specifically designed to fill the remaining space after component placement, enabling precise and reliable resin filling without compromising structural support.
Solution Approach 2:
The auxiliary insulating layers are formed beforehand to match the expected final substrate thickness. This preliminary action ensures that when resin is filled, the space is already properly defined and accessible, achieving high reliability filling precision.
3Reliability
If auxiliary insulating layers are added to match core substrate thickness, then resin filling reliability is improved, but the device complexity increases
Solution Approach 1:
The thickness parameter of the auxiliary insulating layers is precisely controlled to match the core substrate thickness. This parameter optimization ensures reliable resin filling while minimizing the additional complexity introduced by the auxiliary layers.
Solution Approach 2:
The substrate becomes a composite structure combining the core substrate and auxiliary insulating layers. This composite approach improves resin filling reliability while the auxiliary layers are designed to be integrated seamlessly, minimizing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable resin filling without interstices and prevents component peeling or inclination, while maintaining high electrical connection reliability and enabling core substrate thickness adjustment to meet design specifications.
Implementation Method 1
heat-pressing a resin film
Implementation Method 2
forming a first via hole through the second auxiliary insulating layer
Data Source
AI summary
An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively.