Electronic Substrate Test Regions for Resistance Measurement
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Solution Overview
Problem
The existing methods for measuring resistance at the connection portion between a substrate and a driving circuit chip or TCP type film in electronic devices are inadequate, leading to potential driving defects, increased manufacturing costs, and reduced yield due to high contact and connection resistances.
Innovation Solution
A substrate with first and second test regions, each containing measuring pad portions, a protective layer, and a contact assistance member, allowing for the measurement of resistance without additional analysis, by exposing the pad portions through specific contact holes and enabling distinct resistance measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If resistance measurement is performed at the connection portion between substrate and driving circuit chip/TCP film, then connection quality can be evaluated, but the existing measurement methods are inadequate leading to potential driving defects and increased manufacturing costs
Solution Approach 1:
The patent segments the resistance measurement into two distinct test regions: a first test region for measuring contact resistance between the pad portion and driving circuit chip/TCP film, and a second test region for measuring connection resistance through the anisotropic conductive film. This segmentation allows independent optimization and evaluation of each resistance component, resolving the inadequacy of existing unified measurement methods.
Solution Approach 2:
The patent introduces an anisotropic conductive film as an intermediary element between the pad portion and the driving circuit chip/TCP film. This intermediary enables controlled measurement of connection resistance while maintaining the functional integrity of the overall connection structure, allowing precise measurement without compromising driving reliability.
2Ease of manufacture
If contact and connection resistances are not distinguished, then manufacturing process is simpler, but driving defects increase due to inability to identify specific resistance issues
Solution Approach 1:
The patent divides the measurement system into separate test regions with distinct measurement objectives. The first test region measures contact resistance at the pad portion interface, while the second test region measures connection resistance through the anisotropic conductive film. This segmentation enables precise identification of specific resistance issues without significantly complicating the overall manufacturing process.
Solution Approach 2:
The patent applies different measurement configurations to different local regions of the substrate. The first test region uses a configuration optimized for measuring contact resistance at the pad portion, while the second test region uses a configuration optimized for measuring connection resistance through the anisotropic conductive film. This local quality approach enables precise defect identification without requiring complete system redesign.
3Measurement precision
If high contact and connection resistances are present, then measurement can be performed, but manufacturing cost and time increase while yield decreases
Solution Approach 1:
The patent incorporates test regions and measurement structures during the initial manufacturing process rather than adding them as separate post-processing steps. The anisotropic conductive film and test pad portions are integrated into the substrate manufacturing sequence, enabling resistance measurement capability to be built-in from the start. This preliminary action allows early detection of resistance issues, reducing the need for costly rework and improving overall yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate measurement of contact and connection resistances, distinguishing between them, thereby reducing manufacturing defects and costs, and improving yield by correctly determining resistance values at the connection portion.
Implementation Method 1
The protective layer in the first test region includes a first contact hole exposing the plurality of measuring pad portions, and the contact assistance member in the first test region contacts the measuring pad portion exposed through the first contact hole
Data Source
AI summary
A substrate of an electronic device may include a first test region and a second test region to measure resistance at a connection portion. The first test region and the second test region each includes a plurality of measuring pad portions, a protective layer disposed on the plurality of measuring pad portions, and a contact assistance member disposed on the protective layer. The protective layer in the first test region includes a first contact hole exposing the plurality of measuring pad portions. The contact assistance member in the first test region contacts the measuring pad portion exposed through the first contact hole. The protective layer in the second test region includes two second contact holes exposing one measuring pad portion, and the contact assistance member in the second test region contacts the one measuring pad portion through the two second contact holes.