Substrate Retainer Gas Purging for Reaction Tube Cleanliness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing technologies face challenges in efficiently removing foreign substances from the inner walls of reaction tubes, which can adhere and accumulate, affecting the quality of semiconductor device manufacturing.
Innovation Solution
A substrate processing apparatus with a substrate retainer featuring support columns that include hollow portions for inert gas supply and gas supply ports to target the inner wall of the reaction tube, facilitating the removal of foreign substances through inert gas purging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If process gas is supplied to the substrate for film-forming process, then substrate processing is enabled, but foreign substances are adsorbed to the inner wall of the reaction tube
Solution Approach 1:
The gas supply ports are positioned to supply inert gas to the inner wall regions before foreign substances can accumulate significantly. The support columns with hollow portions deliver inert gas proactively to prevent foreign substance adhesion during the film-forming process, rather than cleaning after accumulation occurs.
Solution Approach 2:
Inert gas is introduced as an intermediary substance between the process gas and the inner wall of the reaction tube. The inert gas acts as a protective mediator that prevents foreign substances from adhering to the inner wall by creating a protective gas flow barrier.
2Manufacturing precision
If foreign substances are removed from the reaction tube inner wall, then cleanliness is improved, but additional gas supply infrastructure is required
Solution Approach 1:
The support columns serving the substrate retainer are given a dual function: they both support the substrate retainer structure and serve as gas supply conduits. By making the support columns hollow and incorporating gas supply ports, the same structural elements perform both mechanical support and foreign substance removal functions, avoiding additional dedicated cleaning infrastructure.
Solution Approach 2:
The gas supply system is merged with the substrate support structure. The hollow support columns that already exist for substrate handling are combined with inert gas supply channels, integrating the cleaning function into the existing support infrastructure rather than adding separate cleaning equipment.
3Object-generated harmful factors
If support columns are made hollow for gas supply, then foreign substance removal is enabled, but structural complexity increases
Solution Approach 1:
The support columns are designed with hollow interiors to serve dual purposes: providing structural support for the substrate retainer and acting as gas supply conduits. This multi-functional design allows the same component to perform both mechanical and pneumatic functions without requiring separate structures.
Solution Approach 2:
Gas supply ports are strategically positioned at specific locations on the support columns where they can effectively target the inner wall regions most prone to foreign substance accumulation. The gas supply capability is locally optimized at these port positions rather than uniformly distributed, reducing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively removes foreign substances from the reaction tube inner walls, improving the cleanliness and efficiency of semiconductor device manufacturing processes.
Implementation Method 1
a hollow portion through which an inert gas is supplied; and a gas supply port through which the inert gas is supplied toward an inner wall of the reaction tube
Data Source
AI summary
Described herein is a technique capable of efficiently removing a foreign substance in a reaction tube. According to one aspect of the technique, there is provided a substrate processing apparatus including: a reaction tube in which a substrate is processed; and a substrate retainer including a plurality of support columns configured to support the substrate, wherein at least one among the plurality of the support columns includes: a hollow portion through which an inert gas is supplied; and a gas supply port through which the inert gas is supplied toward an inner wall of the reaction tube.