Substrate Retainer Rotation for Non-Contact Wafer Abnormality Detection
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Solution Overview
Problem
Semiconductor substrates experience cracking and warping due to thermal stress during processing, leading to potential accidents and damage to processing apparatus components when abnormalities occur, such as cracking or warping, which existing detection mechanisms fail to address effectively without physical contact.
Innovation Solution
A method involving a substrate detection mechanism that rotates the substrate retainer by a predetermined angle to detect substrate abnormalities using detection arms and sensors, allowing for non-contact detection of substrate states, including cracks and jump-outs, thereby preventing collisions and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a photo sensor is moved along a vertical axis to detect substrate abnormalities, then substrate detection capability is improved, but the risk of collision with abnormal substrates increases
Solution Approach 1:
The patent introduces a reflective member as an intermediary between the photo sensor and the substrate. The reflective member reflects light from the photo sensor to detect substrate abnormalities (such as cracks or warping) without requiring the photo sensor to physically approach or contact the substrate, thereby maintaining detection precision while eliminating collision risk
Solution Approach 2:
The patent replaces the mechanical approach (moving the photo sensor along the vertical axis close to the substrate) with an optical approach (using light reflection). The photo sensor remains stationary and detects substrate abnormalities through light reflection patterns, substituting mechanical proximity with optical field interaction to avoid physical collision
2Loss of time
If substrate detection is performed at the transferable position, then detection speed is improved, but the risk of substrate collision with detection mechanisms increases
Solution Approach 1:
The reflective member serves as an intermediary that enables detection at the transferable position without direct proximity between the photo sensor and substrate. The light reflection mechanism allows the photo sensor to detect substrate abnormalities from a safe distance, maintaining fast detection speed while eliminating collision risk during substrate transfer operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable detection of substrate abnormalities without physical contact, reducing the risk of accidents and damage to processing apparatus components by identifying and isolating abnormal substrates, ensuring safe and efficient substrate processing.
Implementation Method 1
the substrate on the substrate holder is detected by the photo sensor
Data Source
AI summary
Described herein is a technique capable of detecting a substrate state without contacting the substrate. According to one aspect of the technique, there is provided (a) loading a substrate retainer, where a plurality of substrates is placed, into a reaction tube; (b) processing the plurality of the substrates by supplying a gas into the reaction tube; (c) unloading the substrate retainer out of the reaction tube after the plurality of the substrates is processed; and (d) detecting the plurality of the substrates placed on the substrate retainer after the substrate retainer is rotated by a first angle with respect to a transferable position, wherein the plurality of the substrates is transferable to/from the substrate retainer in the transferable position.