Substrate Reuse and Defect Screening in Electronic Device Manufacturing
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Solution Overview
Problem
The manufacturing cost of existing electronic devices, such as those including light-emitting diodes, is high, necessitating a method to reduce these costs.
Innovation Solution
A manufacturing method for electronic devices that involves forming a sacrificial layer on a substrate, creating a semiconductor structure, separating it from the substrate, detecting defects, and classifying the substrate, which can include using recycled substrates to further reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional manufacturing methods are used for electronic devices, then the manufacturing process is established and reliable, but the manufacturing cost is high
Solution Approach 1:
The patent implements substrate recycling by separating the semiconductor structure from the substrate, inspecting the substrate for defects, and reusing qualified substrates. This recovers valuable substrate materials that would otherwise be discarded, directly reducing manufacturing costs while maintaining process reliability through systematic inspection and classification protocols
2Ease of manufacture
If substrates are reused to reduce costs, then manufacturing cost decreases, but defect detection and classification processes become more complex
Solution Approach 1:
The inspection process is segmented into distinct stages: defect detection, defect classification, and substrate classification. This segmentation allows each stage to be optimized independently and managed systematically, reducing the perceived complexity while enabling comprehensive quality control for recycled substrates
3Manufacturing precision
If substrates are inspected and classified, then substrate quality is improved, but the manufacturing process time increases
Solution Approach 1:
Substrate inspection and classification are performed in advance before the semiconductor manufacturing process begins. This preliminary action ensures that only qualified substrates enter production, preventing defects from propagating through the manufacturing process and reducing rework time, thereby improving overall manufacturing precision without proportionally increasing total process time
Data Source
AI summary
A method of manufacturing an electronic device includes: forming a sacrificial layer on a substrate; forming a semiconductor structure on the sacrificial layer; separating the semiconductor structure from the substrate; detecting defects on the substrate; and classifying the substrate.