Substrate Rotation Reversal for Uniform Photoresist Coating
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Solution Overview
Problem
In semiconductor and display panel manufacturing, the penetration of chemicals into substrates with high aspect ratio patterns is hindered, leading to air voids and non-uniform coating, which affects subsequent processes.
Innovation Solution
A substrate treating method involving the sequential supply of a thinner and photoresist liquid, with controlled rotation directions and speeds, to form and remove liquid films, ensuring uniform coating and minimizing air voids between patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a chemical is supplied onto a substrate with fine high aspect ratio patterns while rotating the substrate, then the chemical fills the pattern spaces, but air voids are formed in spaces where the chemical does not easily penetrate
Solution Approach 1:
The patent applies reverse rotation of the substrate between chemical supply steps. After initially supplying chemical in one rotation direction, the substrate is rotated in the opposite direction to supply additional chemical, ensuring that previously inaccessible spaces (where air voids formed) are now properly filled. This inversion of rotation direction allows the chemical to penetrate different pathologies through the high aspect ratio patterns, eliminating air voids while achieving uniform coating.
2Productivity
If the substrate is rotated in a single direction during chemical supply, then the process is simple and fast, but the chemical cannot uniformly coat the substrate surface
Solution Approach 1:
The patent employs periodic reversal of the substrate rotation direction during the chemical supply process. Instead of continuous rotation in one direction, the rotation is periodically reversed between supply steps. This periodic action allows the chemical to reach different areas of the substrate surface uniformly, improving coating quality while maintaining process efficiency through automated directional control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves efficient and uniform coating of substrates, reducing air voids and enhancing the adherence and reactivity of photoresist liquids, thereby improving the substrate treatment process.
Implementation Method 1
If a chemical is supplied onto a substrate on which a fine pattern with a high aspect ratio is formed, it is difficult for the chemical to penetrate between the patterns. In particular, if the chemical is supplied to the substrate while rotating the substrate in a direction with an axis as a rotation axis, the chemical is filled only in a space of the pattern.
Implementation Method 2
a firstly supplying section in which the first liquid is supplied onto a rotating substrate W; a secondly supplying section in which the first liquid is supplied onto the rotating substrate W after a predetermined time has elapsed from the start of the supplying of the first liquid in the firstly supplying section
Data Source
AI summary
The inventive concept provides a substrate treating method. The substrate treating apparatus includes supplying a first liquid to a rotating substrate to treat a substrate; and supplying a second liquid which is different from the first liquid to the rotating substrate to coat the substrate with the second liquid, and wherein a rotation direction of the substrate is different at the supplying the first liquid and at the supplying the second liquid.