Substrate Rim Slits for Calibrated Adhesive Bonding
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Solution Overview
Problem
Existing bonding methods for substrates, particularly in the microelectronics field, face challenges in controlling the thickness of adhesive layers and ensuring uniformity, often resulting in inhomogeneous interfaces and defective bonds due to excess adhesive and uneven pressure distribution.
Innovation Solution
A method involving a substrate with a salient rim featuring slits to control the adhesive layer thickness, where the rim delineates the bonding space and allows excess adhesive to escape through the slits, ensuring a uniform and defect-free solidified adhesive layer without the need for precise adhesive calibration or external pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a larger quantity of adhesive is deposited to ensure complete coverage, then the bonding coverage is improved, but the adhesive layer thickness becomes inhomogeneous with excess adhesive at the periphery
Solution Approach 1:
The bonding interface is segmented into a central bonding area and a peripheral excess adhesive removal area by the rim structure. The rim divides the adhesive layer into regions where adhesive is retained (central bonding area) and where it can escape (peripheral area through openings), enabling thickness control through spatial segmentation.
Solution Approach 2:
Excess adhesive is extracted from the bonding interface through openings in the rim structure. The rim acts as a barrier that confines adhesive to the central bonding area while providing designated escape paths for excess adhesive at the periphery, removing the harmful excess material from the bonding zone.
2Strength
If pressure is applied to ensure substrate contact, then the bonding strength is improved, but the pressure distribution becomes uneven over large surfaces causing defective bonding
Solution Approach 1:
The system uses self-service through capillary action and surface tension of the adhesive to achieve uniform substrate contact without external pressure application. The adhesive automatically spreads and fills the bonding interface, eliminating the need for external pressure that would cause non-uniform distribution over large surfaces.
3Manufacturing precision
If precise calibration of adhesive quantity is implemented to control thickness, then the adhesive layer thickness uniformity is improved, but the device complexity and process difficulty increase
Solution Approach 1:
The rim structure with openings performs the thickness control function automatically through capillary action and surface tension effects. The system self-regulates the adhesive layer thickness without requiring complex deposition control mechanisms, precise calibration, or sophisticated process control systems.
Solution Approach 2:
The invention changes the physical parameters of the system by introducing a rim structure with specific height and opening characteristics. These geometric parameters control the adhesive layer thickness through capillary pressure and surface tension effects, replacing complex deposition control with simple geometric constraints.
4Reliability
If adhesive is deposited to cover the entire interface, then the bonding coverage is improved, but excess adhesive accumulates at the periphery creating inhomogeneity
Solution Approach 1:
Excess adhesive at the periphery is extracted through openings in the rim structure. The rim acts as a barrier that confines adhesive to the central bonding area while providing designated escape paths for excess material, removing the harmful peripheral accumulation.
Solution Approach 2:
The rim structure creates different local qualities within the bonding interface: a central region where adhesive is retained for bonding, and a peripheral region where adhesive is allowed to escape. This spatial differentiation of adhesive behavior eliminates peripheral excess while maintaining central coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves a solidified adhesive layer of uniform thickness over the entire interface, reducing defects and ensuring consistent bonding without damaging the substrates, applicable to various substrate types, including semiconductor materials.
Implementation Method 1
bringing the two substrates into contact causing spreading of the liquid adhesive
Implementation Method 2
followed by formation of a layer of solidified adhesive between the two substrates
Data Source
AI summary
A bonding method between at least two substrates comprises deposition of at least one drop of liquid adhesive on one of the two substrates and bringing the two substrates into contact causing spreading of the liquid adhesive followed by formation of a solidified adhesive layer between the two substrates. One of the two substrates is further provided, at the surface thereof, with at least one salient rim in which at least one slit is formed, designed to remove the excess liquid adhesive when the two substrates are brought into contact. Finally, the volume of liquid adhesive deposited on one of the two substrates is greater than the volume of the bonding space delineated by said rim between the contacted substrates, and the deposited drop of liquid adhesive presents a strictly greater height than the height of the rim. A defect-free solidified adhesive layer of calibrated thickness can thus be obtained.