Substrate Support Lift-Pin Coupling for Shared Ring Transfer
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Solution Overview
Problem
Conventional plasma processing apparatuses require separate driving mechanisms for substrate and annular member transfer, leading to space constraints and increased costs.
Innovation Solution
A plasma processing apparatus with a common driving mechanism for both substrate and ring assembly transfer, utilizing a lifter system with integrated substrate and ring lift pins and a connection/separation mechanism to facilitate simultaneous vertical movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate driving mechanisms are used for substrate and annular member transfer, then transfer reliability is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent combines separate driving mechanisms into a single integrated driving mechanism that controls both substrate lift pins and ring assembly lift pins. This merging reduces the number of independent mechanisms from two to one, simplifying the overall system while maintaining the ability to independently control substrate and ring assembly transfer operations through a unified control unit.
Solution Approach 2:
The integrated driving mechanism is designed with multi-functionality to perform both substrate transfer and ring assembly transfer operations. The single mechanism includes control units that can independently activate substrate lift pins for substrate transfer and ring lift pins for ring assembly transfer, allowing one mechanism to fulfill multiple transfer functions that previously required separate dedicated mechanisms.
2Ease of operation
If separate driving mechanisms are used for substrate and annular member transfer, then operational control is improved, but space requirements and costs increase
Solution Approach 1:
The patent merges separate driving mechanisms into a single integrated unit located in the space below the substrate support, consolidating control functions and reducing the spatial footprint. The integrated mechanism includes both substrate lift pin control and ring lift pin control within one compact structure, eliminating the need for separate mechanism installations.
Solution Approach 2:
The patent relocates the driving mechanism to operate in the vertical dimension below the substrate support, rather than requiring horizontal space for separate mechanisms. By positioning lift pins vertically beneath the support surface and using actuators that extend downward, the system achieves operational control while minimizing the horizontal area occupied by driving components.
3Area of stationary object
If integrated lift pins are used with common driving mechanism, then space requirements are reduced, but mechanism complexity increases
Solution Approach 1:
The integrated lift pin mechanism is segmented into distinct functional modules: substrate lift pins for substrate transfer, ring lift pins for ring assembly transfer, and a control unit with separate control circuits. This segmentation allows the complex integrated system to be managed through modular components, each performing a specific function while working together within the shared driving mechanism framework.
Data Source
AI summary
Provided is a substrate processing apparatus comprising: a chamber; a substrate support having a substrate support surface and a ring support surface; a first ring disposed so as to surround a substrate; a second ring disposed on the ring support surface; a plurality of substrate lift pins disposed below the substrate support surface; a plurality of ring lift pins corresponding to the respective substrate lift pins, the plurality of ring lift pins being disposed below the ring support surface; at least one actuator configured to vertically move the substrate lift pins; at least one connection/separation mechanism configured to switch a connected state and a separated state between the substrate lift pin and the corresponding ring lift pin; and a controller configured to perform a substrate transfer sequence, a first ring transfer sequence, and a second ring transfer sequence.