Substrate Ring Transfer Modes for Selective Plasma Consumable Replacement
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Solution Overview
Problem
Existing substrate processing systems face challenges in efficiently and selectively replacing consumable members with different replacement times during plasma processes, leading to inefficiencies and downtime.
Innovation Solution
A substrate processing system with a vacuum transfer module, plasma process module, and controller that enables simultaneous and sole transfer modes for edge rings and cover rings, allowing for precise and independent transfer and replacement of consumable members based on their specific requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transfer robot transfers both the edge ring and cover ring together, then the replacement operation is simplified and downtime is reduced, but the flexibility to replace individual rings independently is lost
Solution Approach 1:
The system segments the transfer operation into two independent modes: simultaneous transfer of both rings together, and sole transfer of individual rings separately. This segmentation allows the system to adapt to different replacement scenarios by selecting the appropriate transfer mode, resolving the contradiction between efficiency and flexibility.
Solution Approach 2:
The system dynamically switches between simultaneous transfer mode and sole transfer mode based on the specific replacement requirements. The controller selectively executes the appropriate transfer sequence, enabling the system to optimize for either speed or flexibility depending on the situation.
2Device complexity
If the system uses a fixed transfer sequence for ring replacement, then the control logic is simplified, but the ability to adapt to different replacement schedules and requirements is reduced
Solution Approach 1:
The transfer robot is designed with multi-functionality to perform both simultaneous transfer and sole transfer operations. The controller contains logic for both transfer sequences, allowing the system to universally handle different replacement scenarios without requiring separate dedicated mechanisms for each mode.
3Speed
If the support pins raise both rings together, then the transfer operation is faster and more efficient, but the precision of individual ring positioning may be compromised
Solution Approach 1:
The system dynamically adjusts the support pin operation based on the transfer mode. In simultaneous transfer mode, both rings are raised together for speed. In sole transfer mode, the support pins can selectively raise only the required ring, maintaining precision while still benefiting from automated control.
Data Source
AI summary
A substrate processing system includes a vacuum transfer module; a plasma process module; a transfer robot in the vacuum transfer module; a stage in the plasma process module; a first ring disposed on the stage and a second ring disposed on the first ring to surround a substrate that is placed on the stage, the second ring having an inner diameter smaller than an inner diameter of the first ring; actuators to move support pins vertically to raise the first and the second rings and a transfer jig; and a controller configured to selectively execute a simultaneous transfer mode in which the transfer robot is caused to simultaneously transfer the first ring and the second ring and a sole transfer mode in which the transfer robot is caused to transfer only the second ring.