Substrate Handling Rings With Grounding Plates for Dechuck Control
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Solution Overview
Problem
Substrate handling mechanisms in process chambers do not provide a way to ground and dechuck substrates effectively.
Innovation Solution
A substrate handling system with a substrate support, fixed and moving deposition rings, and electrically conductive grounding plates and lift pins that form a conductive path for grounding substrates during handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If insulated rings are used for substrate transfer, then substrate handling is enabled, but grounding and dechuck capability is lost
Solution Approach 1:
The grounding function is segmented from the substrate support structure by introducing separate grounding plates that can be independently positioned and connected to the substrate edge, allowing grounding capability to coexist with insulated substrate handling
Solution Approach 2:
Conductive grounding plates serve as intermediary elements between the substrate and the grounding system, enabling electrical discharge while maintaining mechanical support through the deposition rings
2Reliability
If grounding plates are added between deposition rings, then substrate grounding is enabled, but device complexity increases
Solution Approach 1:
The grounding plates serve multiple functions: they provide electrical grounding path, support substrate edge, and interface with lift pins for mechanical control, reducing the need for separate dedicated grounding components
Solution Approach 2:
The grounding plates are integrated with the deposition ring structure and lift pin mechanism, combining grounding functionality with existing structural elements rather than adding completely separate systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective discharge of residual electrical charge on substrates during transfer, facilitating safe handling and processing.
Implementation Method 1
a plurality of circumferentially spaced, electrically conductive grounding plates vertically disposed between the fixed deposition ring and the moving deposition ring, each grounding plate configured for vertical movement relative to the fixed deposition ring, and each grounding plate having an electrical contact at the radially inner end; and a plurality of circumferentially spaced, electrically conductive lift pins arranged around the substrate support and under the radially outer ends of the grounding plates
Data Source
AI summary
A substrate handling system includes a fixed deposition ring having a plurality of circumferentially spaced notches along an outer edge of the fixed deposition ring, the fixed deposition ring being electrically non-conductive; a moving deposition ring having a plurality of circumferentially spaced recesses formed on a lower surface of the moving deposition ring, the recesses configured to radially align with the notches of the fixed deposition ring, the moving deposition ring having an inner edge and an outer edge, the moving deposition ring being electrically non-conductive; and a plurality of electrically conductive grounding plates each having a base, an intermediate member, and a contact extending from the intermediate member and being spaced from the base, the intermediate members configured to be received in the recesses and extend between the inner edge and the outer edge of the moving deposition ring.