Substrate Rinse Nozzle Cup Cleaning via Variable Rotation Speed
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Solution Overview
Problem
Existing substrate processing technologies face challenges in effectively cleaning the peripheral edge regions and the interior of the cup during micro-fabrication, particularly in removing adhered substances and contaminants from the back surface of substrates, due to limitations in rotation speed control and liquid distribution.
Innovation Solution
A substrate processing apparatus and method that involves a rotation holding device, a liquid supply system with rinse nozzles positioned on the back surface, and a cup device, where the rotation speed of the substrate is varied between two speeds to ensure effective cleaning of both the peripheral edge and the interior of the cup by controlling the rinse liquid distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is rotated at a constant high speed during rinse liquid supply, then the cleaning efficiency of the substrate surface is improved, but the rinse liquid cannot effectively clean the peripheral region of the nozzle and the outer region of the cup
Solution Approach 1:
The patent applies dynamics by varying the rotation speed of the substrate during the rinse process. The rotation speed is changed from a first rotation speed to a second rotation speed that is different from the first rotation speed. This dynamic adjustment allows the rinse liquid to effectively clean both the substrate surface and the peripheral regions of the nozzle and cup, resolving the contradiction between substrate cleaning efficiency and comprehensive liquid distribution.
2Productivity
If the rotation speed is increased to improve substrate cleaning, then the cleaning speed is improved, but the liquid distribution pattern changes causing inadequate cleaning of the cup interior and nozzle periphery
Solution Approach 1:
The patent implements periodic action by varying the rotation speed during the rinse process. The rotation speed transitions from a first rotation speed to a second rotation speed, creating different liquid distribution patterns at different time periods. This periodic variation ensures that both the substrate surface and the cup interior and nozzle periphery are adequately cleaned, achieving both high cleaning speed and comprehensive coverage.
3Ease of operation
If a single rotation speed is used during rinse liquid supply, then the process control is simplified, but the rinse liquid cannot effectively clean both the substrate peripheral edge and the cup interior
Solution Approach 1:
The patent applies dynamics by implementing variable rotation speed control during the rinse process. The rotation speed is varied from a first rotation speed to a second rotation speed to achieve effective cleaning of both the substrate peripheral edge and the cup interior. This dynamic approach maintains relatively simple process control while significantly improving cleaning effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for thorough cleaning of the substrate's peripheral edge and the cup's interior, enhancing the efficiency of the substrate processing while preventing contamination from accumulated substances.
Implementation Method 1
the rotation holding device varies a rotation speed of the substrate between a first rotation speed and a second rotation speed
Data Source
AI summary
A substrate processing apparatus includes a rotation holding device that holds and rotates a substrate, a liquid supply device including one or more rinse liquid nozzles that are positioned on back surface side of the substrate and supply rinse liquid to peripheral edge portion of back surface of the substrate, a cup that receives the liquid supplied to the substrate, and a control device including circuitry that controls the holding and supply devices. The nozzle is attached to the cup to receive the liquid, and the circuitry controls the holding and supply devices and executes first process in which the holding device varies rotation speed between first and second speeds, and the nozzle supplies the liquid to the peripheral edge portion of the back surface of the substrate such that the liquid cleans peripheral region of the nozzle in the cup and region on outer side of the peripheral region.