Substrate Holding Roller Washing for Particle-Free Clamp Grooves
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Solution Overview
Problem
Conventional substrate holding and rotation mechanisms face inefficiencies in washing away fine particles from the chuck pins, leading to potential re-adhesion onto substrates and contamination, as horizontal washing solutions fail to effectively reach and remove particles from the supporting and gripping portions of the chuck pins.
Innovation Solution
A substrate holding and rotation mechanism featuring a roller washing nozzle that injects fluid diagonally above the substrate holding roller, with a slit-shaped injection hole and switchable modes for comprehensive washing of the clamp groove and upper surface, utilizing pure water and chemical solutions to ensure thorough cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a washing nozzle is provided at approximately the same height as the support portion and the gripping portion, and a washing solution is injected horizontally from the washing nozzle toward the chuck pin, then the washing solution can reach the chuck pin, but the fine particles adhered to the supporting portion and the gripping portion cannot be efficiently removed
Solution Approach 1:
The washing nozzle is repositioned from a horizontal injection approach to an overhead position, injecting washing solution vertically downward onto the substrate holding portion. This dimensional change in injection direction enables the washing solution to effectively reach and remove fine particles from the supporting portion and gripping portion of the chuck pins, which were inaccessible to horizontal injection.
2Device complexity
If the washing solution is injected horizontally from outside the substrate holding portion, then the injection structure is simple, but the droplets including fine particles adhered to the upper surface of the chuck pin cannot be washed away
Solution Approach 1:
The washing nozzle is positioned overhead and injects washing solution vertically downward, creating a washing coverage that includes the upper surface of the chuck pin. This vertical injection approach ensures that droplets containing fine particles on the upper surface are effectively washed away, preventing particle contamination of the substrate, while maintaining a relatively simple washing structure.
3Productivity
If the substrate holding roller is rotated at normal speed during washing, then the washing process is efficient, but the fine particles may spread and re-adhere to the substrate
Solution Approach 1:
The rotation speed of the substrate holding roller is dynamically adjusted during the washing process. The roller rotates at a reduced speed when washing is performed, which prevents the spread and re-adhesion of fine particles to the substrate. After washing is complete, the roller can return to normal rotation speed for substrate processing, thus balancing washing effectiveness with substrate cleanliness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mechanism effectively washes the entire surface of the substrate holding portion, preventing fine particle re-adhesion and ensuring cleaner substrates by rotating the substrate holding roller at a lower speed during fluid injection, allowing for efficient removal of particles from all surfaces.
Implementation Method 1
a roller washing nozzle that injects a fluid from diagonally above the substrate holding roller to an area including the clamp groove and an upper surface of the upper portion of the roller
Data Source
AI summary
A substrate holding and rotation mechanism includes: a substrate holding roller that holds a peripheral portion of the substrate and rotates the substrate, the substrate holding roller including, a lower portion of the roller facing the lower surface of the peripheral portion of the substrate, an upper portion of the roller facing the upper surface of the peripheral portion of the substrate, and a clamping groove which is provided between the lower portion of the roller and the upper portion of the roller and into which the peripheral portion of the substrate is inserted; and a roller washing nozzle that injects a fluid from diagonally above the substrate holding roller to an area including the clamp groove and an upper surface of the upper portion of the roller.