Substrate Rotation Control for Misalignment Detection
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Solution Overview
Problem
Existing substrate processing systems face challenges in accurately detecting the outline position of substrates due to slipping during rotation, leading to erroneous detection of misalignment and chipping errors, particularly when centrifugal forces cause the substrate to shift on the stage.
Innovation Solution
The system employs a control device that initially rotates the stage at a first speed and acceleration, detects the outline position, and if a misalignment threshold is exceeded, it reduces the speed and acceleration for a retry operation to minimize slipping, allowing accurate detection of the substrate's outline position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the stage rotates at high speed and high acceleration to improve processing efficiency, then productivity increases, but the substrate slips due to centrifugal force causing erroneous detection
Solution Approach 1:
The system dynamically adjusts rotation speed and acceleration based on detected misalignment. When substrate slip is detected through misalignment measurement, the control device reduces rotation speed and acceleration for subsequent rotations, creating a dynamic adaptation mechanism that balances speed with reliability
Solution Approach 2:
The control device continuously monitors outline position detection results and uses this feedback to adjust rotation parameters. When misalignment exceeds a threshold indicating substrate slip, the system modifies rotation speed and acceleration in response, forming a closed-loop control system
2Loss of time
If the stage rotates at high speed to reduce processing time, then time consumption decreases, but misalignment detection becomes inaccurate due to substrate slipping
Solution Approach 1:
The system changes rotation parameters (speed and acceleration) based on detection results. When outline position misalignment indicates substrate slip, the control device modifies rotation parameters to lower values, thereby improving measurement precision while minimizing time loss
3Speed
If high acceleration is used to speed up substrate rotation, then processing speed increases, but substrate slip increases causing erroneous chipping detection
Solution Approach 1:
The system implements dynamic adjustment of acceleration based on real-time detection. When misalignment caused by substrate slip is detected, the control device reduces acceleration for subsequent rotations, creating a dynamic balance between rotation speed and alignment precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces erroneous detections and improves production yield by accurately determining substrate misalignment, thereby enhancing the precision and reliability of substrate processing.
Implementation Method 1
a sensor that detects an outline position of the substrate while the substrate is rotated
Data Source
AI summary
A substrate processing system includes a stage on which a substrate is to be placed, a rotation mechanism unit configured to rotate the stage, a sensor configured to detect an outline position of the substrate while the substrate is rotated, and a control device. The control device performs control of:(a) rotating the stage at a first speed and a first acceleration when the substrate is initially rotated;(b) with reference to information on the outline position detected by the sensor when the stage is rotated by one full rotation, determining whether a misalignment amount of the outline position is a threshold value or greater; and(c) rotating the stage at a second speed lower than the first speed, a second acceleration lower than the first acceleration, or both, and performing a retry operation of (b) in response to determining that the misalignment amount is the threshold value or greater.