External Substrate Rotation Module for Uniform Semiconductor Deposition
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Solution Overview
Problem
Existing semiconductor processing methods face challenges in achieving uniform film deposition across substrates due to factors like heater temperature, chamber geometry, and plasma non-uniformity, which can degrade device performance, and require expensive equipment for substrate rotation.
Innovation Solution
A method involving a rotation module that rotates a substrate between processing chambers to enhance film uniformity, using a substrate support assembly with a rotary actuator and measurement module for real-time feedback, allowing film properties to be measured and adjusted during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is rotated during film deposition, then film uniformity is improved, but expensive equipment such as slip rings and rotary unions is required
Solution Approach 1:
The film deposition process is segmented into multiple sequential steps, with the substrate being transferred between different processing chambers. Each chamber deposits a portion of the film, and the substrate is rotated between transfers. This segmentation eliminates the need for continuous rotation during deposition, avoiding expensive rotary joints while achieving uniformity through multiple angled deposits.
Solution Approach 2:
Instead of rotating the substrate in-plane during a single deposition process, the invention transfers the substrate between multiple processing chambers positioned at different locations. The substrate support assembly rotates the substrate to different angular positions before each transfer, effectively using the spatial dimension of multiple chambers to achieve uniformity without requiring in-plane rotation during deposition.
2Manufacturing precision
If substrate rotation is implemented using traditional methods, then film uniformity is improved, but the cost and complexity of the system increases
Solution Approach 1:
The system separates the rotation function from the deposition function. The substrate support assembly provides rotation capability in a simple, low-cost manner, while the deposition process occurs in stationary chambers. This segmentation allows using inexpensive rotation mechanisms without requiring expensive rotary unions that integrate rotation and deposition in a single chamber.
Solution Approach 2:
The substrate support assembly acts as an intermediary between the low-cost rotation mechanism and the deposition chambers. It provides the rotation function using simple mechanics, then transfers the rotated substrate to the deposition chambers. This intermediary approach allows independent optimization of rotation (low cost) and deposition (high precision) without requiring expensive integrated systems.
3Manufacturing precision
If multiple processing chambers are used for film deposition, then film uniformity is improved through substrate rotation, but the processing time increases
Solution Approach 1:
The substrate undergoes continuous processing through multiple chambers in sequence, with each chamber contributing to the film deposition. The substrate support assembly continuously rotates the substrate to different angular positions between transfers, ensuring uniformity is built up progressively. This continuous multi-chamber process achieves uniformity more efficiently than single-chamber rotation methods.
Solution Approach 2:
The substrate is rotated to optimal angular positions before each deposition step in the sequence of chambers. This preliminary positioning ensures that each chamber deposits material on the most appropriate portion of the substrate, maximizing the efficiency of each deposition step and reducing the total number of steps needed to achieve uniformity.
Data Source
AI summary
A method and apparatus for processing a semiconductor is disclosed herein. In one embodiment, a processing system for semiconductor processing is disclosed. The processing chamber includes two transfer chambers, a processing chamber, and a rotation module. The processing chamber is coupled to the transfer chamber. The rotation module is positioned between the transfer chambers. The rotation module is configured to rotate the substrate. The transfer chambers are configured to transfer the substrate between the processing chamber and the transfer chamber. In another embodiment, a method for processing a substrate on the apparatus is disclosed herein.