Substrate-Routed Antenna Packaging for Compact Semiconductor Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large size, leading to suboptimal performance.
Innovation Solution
A semiconductor device design that includes a substrate with a dielectric structure and conductive structure, coupled with electronic components and antenna elements, where the antenna elements are positioned outside the electronic component's footprint and connected through the substrate conductive structure, and encapsulated with a protective layer to provide electrical coupling and environmental protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing cost is high, but reliability is decreased
Solution Approach 1:
The patent segments the antenna system into multiple independent antenna elements that can be separately formed and positioned on the substrate. This allows for optimized placement outside the electronic component footprint while maintaining reliable electrical coupling through the substrate conductive structure, improving reliability without increasing manufacturing complexity
Solution Approach 2:
The patent transitions from traditional planar antenna layouts to a three-dimensional configuration where antenna elements are positioned outside the electronic component footprint on the substrate. This spatial reorganization reduces interference and improves signal reliability while maintaining compact overall package dimensions
2Productivity
If traditional package designs are used, then performance is limited, but package size is large
Solution Approach 1:
The patent merges the antenna elements with the substrate structure by forming them as integrated conductive patterns on the substrate surface. This integration eliminates the need for separate antenna components and reduces overall package size while maintaining or improving performance through optimized electrical coupling
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, electrical interconnection, and antenna functionality. The conductive structure on the substrate simultaneously acts as signal traces and antenna elements, enabling compact design without sacrificing performance
3Volume of stationary object
If antenna elements are integrated within electronic component footprint, then space is saved, but electrical coupling is insufficient
Solution Approach 1:
The substrate conductive structure serves as an intermediary between the antenna elements and the electronic component. This conductive layer provides optimized electrical coupling paths that extend beyond the component footprint, ensuring reliable signal transmission while maintaining compact integration
Data Source
AI summary
A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.