Packaging Substrate Saw Street Layout for Reduced Warping
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Solution Overview
Problem
Packaging substrates deform during high-pressure manufacturing processes, such as overmolding, leading to warping, delamination, and electrical failures in electronic devices.
Innovation Solution
Incorporating saw street features and ground pad features with specific solder mask and metal layer configurations on the packaging substrate's downward-facing surface to provide reduced height non-uniformity, which enhances resistance to deformation under pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If traditional packaging substrate structures are used during high-pressure manufacturing processes, then the substrate undergoes warping and deformation, but adding metal layers and solder mask layers increases structural complexity
Solution Approach 1:
The patent applies local quality by configuring metal layers and solder mask layers specifically within the saw street region rather than uniformly across the entire substrate. This localized approach provides structural support exactly where needed to prevent warping during high-pressure processes, while avoiding unnecessary complexity in other regions. The metal layer (e.g., copper) and solder mask layer are strategically positioned to reinforce the saw street area, addressing the stability issue without globally increasing device complexity.
Solution Approach 2:
The patent employs composite materials by combining metal layers (such as copper) with solder mask layers within the saw street region. This composite structure leverages the high strength and rigidity of metals to provide structural support, while the solder mask layer adds protective and insulating properties. The combination of these materials creates a reinforced composite structure that effectively resists warping and deformation during high-pressure manufacturing processes.
2Ease of manufacture
If the substrate structure is simplified to reduce manufacturing complexity, then deformation resistance during high-pressure processes decreases
Solution Approach 1:
The patent resolves this contradiction by applying the local quality principle, where metal layers and solder mask layers are configured specifically within the saw street region rather than across the entire substrate. This localized reinforcement provides the necessary deformation resistance exactly where structural support is critical during high-pressure processes, while keeping the rest of the substrate structure simple and easy to manufacture. The saw street region acts as a targeted reinforcement zone without complicating the overall fabrication process.
Solution Approach 2:
The patent applies the extraction principle by isolating the complex metal layer and solder mask layer structure specifically to the saw street region, separating it from the rest of the substrate. This extraction allows the complex, high-strength structure to be applied only where needed for deformation resistance, while the remaining substrate maintains its simplicity and ease of manufacture. The saw street region is effectively extracted as a distinct functional zone with enhanced structural properties.
3Reliability
If metal layers and solder mask layers are added to the saw street region, then warping and delamination are reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies local quality by configuring metal layers and solder mask layers specifically within the saw street region rather than uniformly across the entire substrate. This localized approach provides structural support and reliability enhancement exactly where needed to prevent warping and delamination during high-pressure processes, while avoiding unnecessary layer complexity in other regions. The metal layer (e.g., copper) and solder mask layer are strategically positioned to reinforce the saw street area, addressing reliability issues without globally increasing device complexity.
Solution Approach 2:
The patent employs composite materials by combining metal layers (such as copper) with solder mask layers within the saw street region. This composite structure leverages the high strength and rigidity of metals to provide structural support, while the solder mask layer adds protective and insulating properties. The combination of these materials creates a reinforced composite structure that effectively resists warping and delamination during high-pressure manufacturing processes, thereby improving electrical performance stability.
4Ease of manufacture
If the substrate is designed with uniform structure throughout, then manufacturing is simpler, but deformation occurs during high-pressure processes
Solution Approach 1:
The patent resolves this contradiction by applying the local quality principle, where metal layers and solder mask layers are configured specifically within the saw street region rather than uniformly across the entire substrate. This localized reinforcement provides the necessary structural support and flatness maintenance exactly where needed during high-pressure processes, while keeping the rest of the substrate structure simple and uniform for ease of manufacture. The saw street region acts as a targeted reinforcement zone without complicating the overall fabrication process.
Solution Approach 2:
The patent applies segmentation by dividing the substrate into distinct functional regions: the saw street region with enhanced metal layer and solder mask layer configuration, and the remaining substrate areas with standard structure. This segmentation allows the complex reinforced structure to be applied only where structural support is critical, while the majority of the substrate maintains its simplicity and uniformity for ease of manufacture.
Data Source
AI summary
A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.