Substrate Sealing Structure to Prevent Air Pockets in LED Packages
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Solution Overview
Problem
Existing electronic device manufacturing techniques face challenges in extending the operating service life and improving packaging reliability, particularly in ensuring a tight seal between substrates to prevent air inclusion and subsequent defects like fractures and cracks, which can shorten the service life of light-emitting diodes.
Innovation Solution
The method involves a transparent material layer and a sealing material with different viscosities, where the transparent material layer is applied on the first substrate and the sealing material surrounds it, with both layers being cured to form a robust seal between the first and second substrates, reducing the likelihood of air inclusion and enhancing the reliability and service life of the electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single material layer is used for sealing between substrates, then the manufacturing process is simple, but air inclusion occurs leading to fractures and cracks that reduce service life
Solution Approach 1:
The sealing structure is divided into two distinct material layers: a first material layer with high viscosity and a second material layer with low viscosity. This segmentation allows each layer to perform its specific function - the first layer provides structural support and sealing, while the second layer fills gaps and prevents air inclusion, thereby resolving the contradiction between reliability and complexity.
Solution Approach 2:
The patent employs a composite material structure consisting of two materials with different viscosity characteristics. This composite approach combines the advantages of both materials - the high viscosity material provides robust sealing while the low viscosity material ensures complete gap filling - achieving enhanced reliability without excessive complexity.
2Strength
If high viscosity sealing material is used, then structural strength is improved, but air pockets are trapped between substrates reducing reliability
Solution Approach 1:
The sealing function is segmented between two material layers with different viscosity properties. The first high viscosity layer provides the required structural strength and sealing, while the second low viscosity layer is specifically tasked with filling gaps and eliminating air pockets, thus resolving the contradiction between strength and reliability.
Solution Approach 2:
Different regions of the sealing structure use materials with different viscosity characteristics tailored to local requirements. The first material layer uses high viscosity material where structural strength is needed, while the second layer uses low viscosity material where gap filling and air elimination are critical, achieving both strength and reliability.
3Reliability
If low viscosity material is used for sealing, then air inclusion is reduced, but structural strength and seal integrity are compromised
Solution Approach 1:
The sealing structure is segmented into two functional layers: the first layer uses high viscosity material for structural strength and seal integrity, while the second layer uses low viscosity material for air-free operation. This segmentation allows each material to optimize its performance without compromising the other.
Solution Approach 2:
The patent creates a composite sealing structure combining high viscosity and low viscosity materials in specific layers. This composite approach allows the structure to simultaneously achieve the structural integrity provided by high viscosity material and the air-free operation provided by low viscosity material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the probability of air pockets between substrates, thereby improving the service life and reliability of the electronic device by preventing defects such as fractures and cracks, and ensuring uniform light emission and display quality.
Implementation Method 1
both layers being cured to form a robust seal between the first and second substrates
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 2
AI summary
The disclosure provides an electronic device (100a) and a method of manufacturing an electronic device (100a). The electronic device (100a) includes a first substrate (110), a plurality of light-emitting dies (120), a transparent material layer (150), a sealing material (160), and a second substrate (140). The plurality of light-emitting dies (120) are disposed on the first substrate (110). The transparent material layer (150) is disposed on the first substrate (110). The sealing material (160) is disposed on the first substrate (110) and surrounds the transparent material layer (150). The second substrate (140) is adhered to the first substrate (110) through the transparent material layer (150) and the sealing material (160).