Substrate Sealing Structure with Barrier Rib for Display Devices
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Solution Overview
Problem
Existing substrate sealing structures for electronic elements, such as organic EL display elements, face challenges in preventing degradation due to heat and moisture penetration during the sealing process, particularly when using glass frits and resins that can generate gases and increase temperatures, potentially damaging the elements.
Innovation Solution
A substrate sealing structure using a low melting point glass material as a sealing agent, applied in separation from the electronic element and surrounded by a barrier rib, which shields the element from heat and prevents gas generation during the sealing process, ensuring effective sealing without degrading the electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass frit is used for sealing agent and adhered by laser light, then sealing reliability is improved, but temperature increases to 350-600 degree Celsius causing degradation of light emitting element characteristics
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the glass frit sealing agent and the light emitting element. This resin layer absorbs and buffers the heat generated during laser light adhesion, preventing direct thermal contact with the light emitting element while maintaining the sealing effectiveness of the glass frit.
Solution Approach 2:
The resin layer is applied in advance before the glass frit sealing process. This pre-positioned cushioning layer is specifically designed to withstand and dissipate the thermal energy from laser heating, protecting the light emitting element from temperature-induced degradation before the sealing process begins.
2Reliability
If sealant portion or first sealing line increases in temperature during curing, then gas is generated, but gas remains in surrounding of light emitting element causing detrimental influence
Solution Approach 1:
The resin layer serves as a mediator that manages gas generation during curing. By positioning the resin between the sealing structures and the light emitting element, any gases produced during temperature increase are directed away from the sensitive element, preventing detrimental effects while maintaining sealing integrity.
Solution Approach 2:
The harmful effect of gas generation is extracted and isolated from the light emitting element through the resin layer. The resin acts as a buffer zone that contains and manages gas evolution, separating the gas generation process from the light emitting element to eliminate detrimental influences.
3Reliability
If double sealing structure is used with first sealing line and second sealing line, then sealing reliability is improved, but complexity of sealing structure increases
Solution Approach 1:
The patent combines the sealing function with the adhesion function into a single integrated glass frit sealing agent structure. This merged approach eliminates the need for separate first and second sealing lines, reducing structural complexity while maintaining sealing reliability through the laser-adhered glass frit that provides both sealing and bonding functions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents degradation of electronic elements by reducing heat transfer and gas generation, providing reliable sealing against moisture and oxygen while maintaining the integrity of the organic EL display elements.
Implementation Method 1
adhered onto each of the first substrate and the second substrate by heating it using laser light
Implementation Method 2
the sealing agent comprises a low melting point glass material
Implementation Method 3
a barrier rib being formed to surround the outer periphery of the electronic element is arranged between the sealing agent and the electronic element
Data Source
AI summary
In the present embodiment, a sealing agent (50) sealing two substates contains a low melting-point glass material and is adhered to each of a first substrate (10) and a second substrate (20), a barrier rib (60), which is formed in such a manner as to surround the outer periphery of an electronic element (30), is disposed between the sealing agent (50) and the electronic element (30), and between the first substrate (10) and the second substrate (20), and the sealing agent (50) is spaced apart from the barrier rib (60). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two substrates is protected from moisture and oxygen.


