Substrate Defect Inspection via Segment Mode Pattern Comparison
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Solution Overview
Problem
Conventional substrate inspection methods, such as Random Mode and Array Mode, are limited in inspecting single dies with non-repetitive or irregularly distributed repetitive patterns, as they require a reference die or database graphic, which raises confidentiality concerns and are not practical for single die inspection without repetition or orderly distribution.
Innovation Solution
The Segment Mode method involves providing images of substrates, identifying target patterns that occur multiple times, and comparing these occurrences to detect defects, allowing for single die inspection without the need for a reference die or database graphic, by defining segments and creating segment maps to group and compare target patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Random Mode or Array Mode inspection methods are used, then defect detection capability is improved, but reference die or database graphic is required which raises confidentiality concerns and limits single die inspection
Solution Approach 1:
The die is divided into multiple segments based on pattern types (repetitive, non-repetitive, regularly distributed, irregularly distributed). Each segment is inspected using the most appropriate mode (Array Mode for repetitive patterns, Random Mode for non-repetitive patterns), eliminating the need for a single reference die and enabling confidential single die inspection while maintaining high defect detection capability.
2Productivity
If Array Mode inspection is used for regularly distributed repetitive patterns, then inspection efficiency is improved, but it cannot inspect irregularly distributed repetitive patterns or non-repetitive patterns
Solution Approach 1:
The inspection system dynamically adapts its operating mode based on the detected pattern characteristics. For regularly distributed repetitive patterns, it operates in Array Mode for high efficiency. For irregularly distributed repetitive patterns or non-repetitive patterns, it automatically switches to Random Mode, ensuring both high productivity and universal adaptability across all pattern types.
3Adaptability or versatility
If Random Mode inspection is used for non-repetitive patterns, then single die inspection is enabled, but inspection efficiency decreases compared to Array Mode
Solution Approach 1:
The die is segmented into regions with different pattern characteristics. Repetitive pattern regions are inspected using efficient Array Mode, while non-repetitive pattern regions are inspected using Random Mode. This segmented approach maximizes inspection efficiency while maintaining the ability to perform confidential single die inspection where needed.
Data Source
AI summary
A substrate inspection method is disclosed. The disclosed method includes 1) providing one or more images of one or more sample substrates; 2) identifying, from the images, two or more occurrences of a target pattern in the images; and 3) comparing the identified target-pattern occurrences against each other to determine, from the images, a presence of abnormalities in the compared target-pattern occurrences, hence determining one or more defects physically present in the target-pattern occurrences. The disclosed method may be implemented via execution of a computer program encoded in a computer readable medium, where the computer program instructs an imaging apparatus to form images of the of-interest sample substrates and instructs an image analyzing apparatus to identify and compare, from the images, the target-pattern occurrences on the sample substrates.