Multilayer Substrate with Segmented Inorganic Fillers for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for improving heat dissipation in circuit board substrates are insufficient due to limitations in arranging inorganic fillers within small gaps, leading to low thermal conductivity and inefficient heat dissipation.
Innovation Solution
A substrate with a fabric-like member featuring first inorganic fillers on its surface, including boron nitride, aluminum oxide, or magnesium oxide, with smaller particle sizes, and second inorganic fillers of larger scaly shape, strategically positioned to enhance thermal conductivity and heat dissipation, and a multilayer substrate formed by laminating these substrates with conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If inorganic fillers are mixed and immersed in resin to improve heat dissipation, then thermal conductivity is improved, but the fillers cannot be arranged in small gaps among particles or glass cloth, limiting efficient heat dissipation
Solution Approach 1:
The invention segments the filler arrangement into two distinct size categories: first inorganic fillers with particle size of 10 μm or less (preferably 1 μm or less) that can penetrate and fill small gaps between glass cloth fibers, and second inorganic fillers with larger particle size (5 μm to 15 μm longitudinal length) that provide structural support and additional thermal pathways. This segmentation resolves the contradiction by enabling proper filler distribution in both small gaps and larger spaces.
Solution Approach 2:
The invention applies local quality by using first inorganic fillers specifically in regions requiring fine gap filling (between glass cloth threads) while using second inorganic fillers in regions requiring larger structural presence. The first fillers with smaller particle size are strategically placed to fill inter-fiber spaces, while second fillers with larger scaly shapes provide surface coverage and thermal conduction pathways, creating localized optimization throughout the substrate structure.
2Temperature
If inorganic fillers are used to improve heat dissipation, then thermal conductivity increases, but substrate strength and flexibility may be compromised
Solution Approach 1:
The invention creates a composite material system combining glass cloth (fabric-like member), first inorganic fillers (small particle size ≤10 μm), second inorganic fillers (larger particle size 5-15 μm), and resin. This multi-component composite leverages the strengths of each material: glass cloth provides tensile strength and flexibility, first inorganic fillers fill micro-gaps and enhance thermal conduction in confined spaces, second inorganic fillers provide structural reinforcement and thermal pathways, and resin binds all components together. The synergistic combination maintains substrate strength while achieving superior heat dissipation.
Solution Approach 2:
The invention optimizes the particle size parameter of inorganic fillers to resolve the strength-thermal conductivity contradiction. By specifying first inorganic fillers with particle size of 10 μm or less (preferably 1 μm or less), these small particles can penetrate glass cloth pores without creating stress concentration points that would weaken the substrate. The second inorganic fillers with controlled larger sizes (5-15 μm longitudinal length) provide structural support. This precise parameter control enables both high thermal conductivity and maintained substrate strength.
3Temperature
If conventional inorganic fillers are used, then heat dissipation is partially improved, but there is a limit to efficient heat dissipation due to inability to fill small gaps
Solution Approach 1:
The invention segments the filler population into two size classes with clear boundaries: first inorganic fillers (≤10 μm, preferably ≤1 μm) for micro-gap filling and second inorganic fillers (5-15 μm longitudinal length) for macro-structure support. This segmentation enables manufacturing precision by providing clear size specifications that guide the filler selection and application process, ensuring that appropriately sized fillers are used for their intended purposes without requiring complex arrangement techniques.
Solution Approach 2:
The invention changes the particle size parameter of inorganic fillers to achieve both efficient heat dissipation and manufacturing precision. By specifying first inorganic fillers with particle size of 10 μm or less (preferably 1 μm or less), these particles can naturally fill small gaps between glass cloth fibers through their small size, eliminating the need for complex arrangement processes. The second inorganic fillers with larger sizes (5-15 μm) provide visible structural elements. This parameter specification simplifies manufacturing while achieving superior heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances heat dissipation by allowing efficient heat discharge through the high thermal conductivity fillers, improving thermal conductivity and maintaining substrate strength and flexibility.
Implementation Method 1
first inorganic fillers which exist on a surface of the fabric-like member... efficiently discharge heat
Implementation Method 2
second inorganic fillers each having a particle size larger than that of each of the first inorganic fillers... enhance thermal conductivity
Data Source
AI summary
A substrate includes a fabric-like member. First inorganic fillers exist on a surface of the fabric-like member.