Substrate Sensor Alignment for Precise Plasma Chamber Transfer
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Solution Overview
Problem
The existing substrate treating apparatuses face challenges in accurately aligning and seating the substrate type sensor, which is crucial for proper plasma etching processes, due to limitations in the dedicated containers and varying treatment environments, leading to inefficiencies in image acquisition and auto teaching of transfer robots.
Innovation Solution
The apparatus includes an alignment unit with a support member, sensor member, and controller that aligns the substrate type sensor by moving and rotating it within the index chamber, using suction and pressure reduction to ensure precise positioning, and determines alignment based on notch detection and gas flow, enabling efficient transfer to the process chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a wafer type sensor is used to identify the focusing ring positioning location and perform auto teaching of the transfer robot, then the positioning accuracy and automation level are improved, but the alignment difficulty and device complexity increase due to the lack of dedicated alignment structures in varying treatment environments
Solution Approach 1:
The patent introduces an alignment mark as an intermediary element that facilitates the alignment process. The alignment mark is formed on the substrate and serves as a reference for the transfer robot to accurately position the wafer type sensor, thereby simplifying the alignment process without requiring complex dedicated alignment structures in the treatment environment
Solution Approach 2:
The patent uses the alignment mark as a simplified copy or representation of the focusing ring's position. Instead of directly detecting the focusing ring, the system detects the alignment mark which represents the desired position, making the measurement process easier and more adaptable to different treatment environments
2Measurement precision
If a dedicated container with alignment structure is manufactured to align the wafer type sensor, then the alignment precision is improved, but the manufacturing cost and adaptability to different treatment environments deteriorate
Solution Approach 1:
The alignment mark serves multiple functions: it aligns the wafer type sensor, guides the transfer robot, and works across different treatment environments without requiring environment-specific modifications. This universal approach eliminates the need for dedicated containers while maintaining alignment precision
Solution Approach 2:
The patent extracts the alignment function from the container structure and relocates it to the substrate itself through the alignment mark. This separation allows the alignment mechanism to be independent of the container design, thereby improving adaptability to different treatment environments while maintaining precision
3Ease of operation
If the wafer type sensor is transferred without proper alignment structures, then the ease of operation and adaptability are improved, but the alignment precision and image acquisition effectiveness deteriorate
Solution Approach 1:
The substrate provides its own alignment feature through the alignment mark, eliminating the need for external alignment structures or complex container designs. The transfer robot can directly use the alignment mark for positioning, making the operation simpler while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient alignment and effective image acquisition within the process chamber, enhancing the auto teaching of transfer robots and ensuring precise substrate treatment, even in environments without dedicated alignment structures.
Implementation Method 1
determines alignment based on notch detection and gas flow
Implementation Method 2
using suction and pressure reduction to ensure precise positioning
Implementation Method 3
using suction and pressure reduction to ensure precise positioning
Data Source
AI summary
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an index unit including a load pot, in which a container is seated, and an index chamber connected to the load pot, and a process executing unit having a load lock chamber connected to the index chamber and a process chamber that treats a substrate transferred to the load lock chamber, the index unit further includes an alignment unit provided in the index chamber and that aligns a substrate type sensor transferred to the process chamber.