Substrate Separation With Asymmetrical Beam Control of Crack Path
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Solution Overview
Problem
Current methods for separating substrate elements, such as glass plates, fail to control the course of the separation face accurately, require high crushing forces, and result in low edge strength of the separated sub-elements due to uncontrollable crack formation and microcracks.
Innovation Solution
A method using an asymmetrical beam supply for a light beam to form a line focus within the substrate material, reducing lateral beam components that interact with formed cavities, allowing precise control of the separation face and minimizing microcracks, thereby enhancing edge strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser perforation methods are used to create cavities along the separation face, then material removal occurs at desired locations, but the course of the crack line cannot be controlled and deviates from the perforation line
Solution Approach 1:
The patent applies asymmetry by using a light beam with asymmetrical beam supply that has a centroid of area offset from the geometric center. This asymmetrical energy distribution creates a line focus that generates cavities with controlled positioning, ensuring the crack line follows the desired separation face course rather than deviating as with conventional symmetrical beam methods
Solution Approach 2:
The patent changes the parameter of beam energy distribution by positioning the centroid of area of the light beam's energy distribution away from the geometric center. This parameter modification alters the cavity formation mechanism, enabling precise control over the crack line course and separation face accuracy
2Productivity
If high crushing force is applied to separate the substrate element along the perforation line, then separation occurs, but new damages occur to the substrate material and edge strength decreases
Solution Approach 1:
The patent applies preliminary action by using the asymmetrical beam supply to pre-form cavities and initiate cracks along the exact desired separation face course before any crushing or separation force is applied. This preliminary cavity formation ensures that subsequent separation requires minimal force and follows the predetermined path, preventing new damages and maintaining edge strength
3Manufacturing precision
If the distance between adjacent cavities is reduced to improve separation face control, then more cavities are needed, but the force required for crushing increases again
Solution Approach 1:
The patent changes the parameter of beam energy distribution asymmetry to optimize cavity formation efficiency. By adjusting the centroid offset and energy distribution pattern, the method achieves effective separation face control with fewer cavities spaced at optimal distances, avoiding the need to reduce cavity spacing to the point where crushing force increases
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves precise control over the separation face with reduced crushing force, improving edge strength and reducing additional damage to the substrate elements.
Implementation Method 1
controlling a line focus in the substrate body so that the substrate material of the substrate body is at least locally removed and/or displaced along the separation face at least section-wise, wherein the line focus represents a focus of a light beam
Implementation Method 2
The light beam is formed at least in the area of the line focus in the form of a light beam with an asymmetrical beam supply
Data Source
AI summary
A substrate sub-element has at least one body. The body has at least one material from the group consisting of: glass, glass ceramic, and silicon. The body also has at least one side face. The side face has a height-modulated surface over at least a portion thereof, a surface roughness over at least a portion thereof, and a variation of the surface due to the surface roughness between 1 and 5 orders of magnitude less than a variation of the surface due to the height modulation.