Substrate Separation Control Using Notch Start and Feedback Sensing
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Solution Overview
Problem
The challenge in semiconductor manufacturing is the risk of bending or breaking thin, large-diameter semiconductor substrates during transfer or polishing, which can lead to cracks when a support substrate is pushed upwards during separation, as existing methods may inadvertently push the substrate, causing damage.
Innovation Solution
A separating apparatus that includes a notch device to form notches in the substrate, a holder to attract and elevate the substrate, and a detection system to control the attraction process, allowing for controlled movement and stopping of the attraction member to prevent excessive pushing and minimize substrate damage, using a controller to manage the attraction mechanism's speed and position to ensure safe separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the support substrate is pushed upwards during separation, then the substrates can be separated, but cracks may occur in the substrates
Solution Approach 1:
A notch is formed at the separation start point on the side surface of the combined substrate before the attraction process begins. This preliminary action creates a stress concentration point that guides the separation process and prevents random crack formation during substrate separation
Solution Approach 2:
A detection device monitors the attraction process in real-time to detect when the first substrate has been successfully attracted to the attraction member. The controller uses this feedback information to stop the attraction process at the appropriate moment, preventing excessive force application that could cause substrate cracks
2Productivity
If the attraction member moves quickly to attract the substrate, then the separation process is faster, but excessive force may push the substrate causing damage
Solution Approach 1:
The attraction member's movement speed is dynamically adjusted during the attraction process. The system operates in two phases: a first movement phase at higher speed to quickly close the gap, and a second movement phase at lower speed to gently complete the attraction, preventing substrate damage while maintaining overall process efficiency
Solution Approach 2:
The detection device provides real-time feedback on substrate attraction status, allowing the controller to adjust the attraction member's movement and stopping points dynamically. This ensures the substrate is attracted sufficiently for separation without applying excessive force that could cause cracks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively suppresses the occurrence of cracks in the substrates by monitoring and controlling the attraction process, ensuring precise separation without excessive force, thereby maintaining substrate integrity.
Implementation Method 1
a start point side attraction member that attracts an edge of an outer periphery located most adjacent to a separation start point in the outer periphery of the first substrate
Data Source
AI summary
A separating apparatus includes a notch device configured to form a notch by inserting a sharp member into a side surface located most adjacent to a separation start point; a first holder including a start point side attraction member and a start point side elevating mechanism; a second holder configured to attract and hold a second substrate; a detection device; and a controller configured to form the notch in the side surface, and lower the start point side attraction member to attract it to a first substrate. The controller moves the start point side attraction member from a standby position to a speed-change position at a first speed; moves the start point side attraction member from the speed-change position to be close to the first substrate at a second speed; and stops the start point side attraction member when it is determined that the first substrate is attracted.