Substrate Separation System with Pneumatic Blowing and Suction
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Solution Overview
Problem
Existing methods for removing substrates from carriers are inefficient, either requiring manual labor or costly laser technology, and do not effectively address the need for high-density integration in miniaturized electronic products.
Innovation Solution
A substrate separation system comprising a stage, upper fixing portion, suction portion, cutting portion, and blowing portion that automates the substrate removal process by fixing, cutting, suctioning, and blowing to separate the substrate from the carrier, enhancing efficiency and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual method is used to remove substrate from carrier, then operation simplicity is maintained, but productivity is low
Solution Approach 1:
The substrate separation system is divided into multiple functional modules: upper fixing portion for clamping the substrate, suction portion for holding the substrate edge, cutting portion for separating the substrate from carrier, and blowing portion for assisting separation. Each module performs a specific function, enabling automated high-efficiency substrate removal while maintaining manageable system complexity through modular design
Solution Approach 2:
The patent replaces manual mechanical operations with an automated system that combines mechanical clamping (upper fixing portion), pneumatic suction (suction portion), mechanical cutting (cutting portion), and pneumatic blowing (blowing portion). This substitution of manual labor with automated mechanical and pneumatic systems significantly improves productivity while keeping the device structure organized and maintainable
2Productivity
If laser method is used to remove substrate from carrier, then productivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent employs pneumatic principles through the suction portion that uses vacuum pressure to hold the substrate edge, and the blowing portion that uses compressed air to assist substrate separation from the carrier. This pneumatic approach replaces expensive laser systems with cost-effective air pressure control mechanisms while maintaining high productivity and automated operation
Solution Approach 2:
The cutting portion uses a disposable or replaceable cutting blade that can be easily更换 when worn, replacing the need for expensive laser equipment. This approach reduces manufacturing costs significantly while maintaining efficient substrate separation capability
3Productivity
If automated separation system is implemented, then productivity is improved, but device complexity increases
Solution Approach 1:
The upper fixing portion serves multiple functions: it clamps the substrate during cutting operations and can also work in coordination with the suction portion during separation. The suction portion both holds the substrate edge and assists in lifting it during separation. This multi-functionality reduces the total number of components needed, improving productivity while controlling device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables efficient, cost-effective, and damage-free automatic separation of substrates from carriers, suitable for high-density electronic product manufacturing.
Implementation Method 1
moving the suction portion downwards to suck a periphery of an upper surface of the substrate; moving the suction portion upwards to lift the periphery of the upper surface of the substrate
Implementation Method 2
providing a blowing force to a position between the substrate and the carrier by the blowing portion
Data Source
AI summary
A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.