Substrate Separation via Side-Fluid Contact
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Solution Overview
Problem
In semiconductor manufacturing, thin large-diameter substrates are prone to bending or breaking during transfer or polishing, necessitating reinforcement with a support substrate and subsequent separation, with existing techniques being inefficient for separating substrates bonded by strong intermolecular forces.
Innovation Solution
A separating method and apparatus that holds a combined substrate and separates the first substrate from the second by bringing a fluid, such as water, into contact with the side surface, using a blade to reduce bonding strength and facilitate separation, while using holders and moving units to efficiently separate the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrates are bonded by strong intermolecular forces to reinforce thin large-diameter semiconductor substrates, then substrate strength and stability are improved, but separation efficiency and ease of operation deteriorate
Solution Approach 1:
The separation process is segmented into multiple stages: initial insertion of separation start portion, followed by progressive separation in predetermined directions. This staged approach allows controlled breaking of strong intermolecular bonds without requiring excessive force at any single point, resolving the contradiction between strong bonding and easy separation.
Solution Approach 2:
A separation start portion is inserted into the bonded substrate to act as an intermediary tool. This intermediary initiates and guides the separation process by providing a physical entry point that progressively disrupts the intermolecular bonding, making separation feasible without directly applying excessive force to the bonded surfaces.
2Strength
If conventional separation methods are used for strongly bonded substrates, then substrate reinforcement is maintained, but separation time and productivity are reduced
Solution Approach 1:
The separation apparatus employs dynamic movement in predetermined directions to progressively separate substrates. Instead of static force application, the system dynamically advances the separation front through controlled motion, enabling efficient breakdown of strong bonds over time and space, thereby improving productivity without compromising bonding strength during the process.
Solution Approach 2:
The separation start portion is preliminarily inserted into the bonded substrate before full separation begins. This preliminary action creates an initial separation point that facilitates subsequent separation progress, reducing the overall time and effort required for complete substrate separation while maintaining bonding integrity until separation is initiated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the efficiency of the substrate separation process by reducing bonding strength and enabling accurate and efficient separation of substrates with high bonding strength, even when bonded by intermolecular forces.
Implementation Method 1
brining a fluid containing water into contact with the side surface
Data Source
AI summary
A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.