Adjustable Showerhead Elevation and Tilting for Substrate Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in adjusting the distance between the substrate and the showerheads, as well as tilting the substrate or showerheads, which affects the precision and accuracy of substrate processing due to potential bowing of the substrate.
Innovation Solution
The substrate processing apparatus is designed with adjustable elevation and tilting units for both the upper and lower showerheads, allowing for precise control of the distance and orientation between the substrate and the showerheads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is processed with fixed distances between substrate and showerheads, then the apparatus structure is simple, but the manufacturing precision deteriorates due to substrate bowing
Solution Approach 1:
The patent applies the dynamics principle by making the distances between the substrate and showerheads adjustable rather than fixed. The first elevation unit allows the lower showerhead assembly to move vertically to adjust the first distance, while the second elevation unit allows the substrate supporter to move vertically to adjust the second distance. This dynamic adjustability enables compensation for substrate bowing and maintains manufacturing precision.
Solution Approach 2:
The patent applies the parameter changes principle by enabling continuous adjustment of critical geometric parameters (distances between substrate and showerheads). Through the elevation units, the system can change the first distance and second distance to optimal values for each processing step, thereby maintaining high manufacturing precision across different processing conditions.
2Adaptability or versatility
If the substrate and showerheads are kept parallel, then the alignment is simple, but the adaptability deteriorates when non-parallel configuration is needed
Solution Approach 1:
The patent applies the dynamics principle by introducing tilting mechanisms that allow the lower showerhead assembly and substrate supporter to rotate relative to each other. The first tilting unit enables the lower showerhead assembly to tilt, while the second tilting unit enables the substrate supporter to tilt, providing dynamic reconfigurability between parallel and non-parallel arrangements.
Solution Approach 2:
The patent applies the segmentation principle by dividing the tilting function into separate units: the first tilting unit for the lower showerhead assembly and the second tilting unit for the substrate supporter. This segmentation allows independent adjustment of each component's orientation, providing flexibility while maintaining manageable complexity through modular design.
3Manufacturing precision
If the distance between substrate and showerheads is fixed, then the device complexity is low, but the manufacturing precision deteriorates due to inability to control plasma gap
Solution Approach 1:
The patent applies the dynamics principle by making the plasma gap controllable through vertical movement of the lower showerhead assembly and substrate supporter. The first and second elevation units enable real-time adjustment of the gaps, allowing precise control of plasma parameters during processing.
Solution Approach 2:
The patent applies the feedback principle by enabling continuous monitoring and adjustment of the distances and orientations. The system can detect deviations in substrate position or plasma characteristics and automatically adjust the elevation and tilting mechanisms to maintain optimal processing conditions.
Data Source
AI summary
A substrate processing apparatus includes a chamber, an upper showerhead, a substrate supporter, a lower showerhead assembly, first and second elevation units, and first and second tilting units. The chamber provides a processing space for a substrate, and the upper showerhead is provided in an upper region of an interior of the chamber. The substrate supporter is provided in the interior of the chamber to support the substrate, and the lower showerhead assembly is provided in an interior of the substrate supporter to supply process gas to the substrate. The first elevation unit adjusts a gap between the substrate and the lower showerhead assembly, and the first tilting unit tilts the lower showerhead assembly with respect to the substrate. The second elevation unit adjusts a gap between the substrate and the upper showerhead, and the second tilting unit tilts the substrate with respect to the upper showerhead.