Packaging Substrate Side-Surface Pin Layout for Smaller Packages
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Solution Overview
Problem
The increasing number of connection structures on packaging substrates leads to larger packaging sizes, causing thermal deformation issues in chips due to the increased number of pins on the substrate.
Innovation Solution
Incorporating third connection structures on the side surface of the packaging substrate, connected via metal cabling, to redistribute pins from the second surface to the side and first surfaces, reducing the overall packaging size while maintaining connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the quantity of first connection structures and pins is increased to meet growing connectivity requirements, then the connectivity capability is improved, but the packaging size increases causing thermal deformation issues
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional pin arrangement (only on the second surface) to a three-dimensional arrangement that includes the side surface. Specifically, third connection structures are added on the side surface of the packaging substrate, allowing pins to be distributed across multiple surfaces and dimensions. This enables the same or greater connectivity capability to be achieved within a smaller footprint area, directly resolving the technical contradiction between connectivity and packaging size.
2Quantity of substance
If more pins are disposed on the second surface to increase connectivity, then the connectivity capability is improved, but the packaging substrate area must be enlarged
Solution Approach 1:
The patent distributes pins across multiple dimensions by placing third connection structures on the side surface in addition to the second surface. This multi-surface distribution allows a large quantity of pins to be accommodated without proportionally increasing the substrate area, as pins utilize the vertical and lateral dimensions more efficiently rather than spreading out on a single large plane.
3Area of stationary object
If the packaging substrate area is reduced to minimize packaging size, then the packaging size is reduced, but it becomes difficult to accommodate sufficient pins for connectivity
Solution Approach 1:
By utilizing the side surface as an additional dimension for pin placement, the patent achieves high pin density within a compact substrate area. The third connection structures on the side surface provide additional pin capacity without requiring proportional increases in the substrate's planar area, enabling small packaging size while maintaining sufficient pin quantity.
4Device complexity
If pins are concentrated on the second surface, then the connection structure is simple, but thermal deformation problems occur due to large packaging size
Solution Approach 1:
The patent segments the pin distribution across different surfaces of the packaging substrate. Instead of concentrating all pins on the second surface, the connection structures are divided into second connection structures on the second surface and third connection structures on the side surface. This segmentation allows the packaging substrate to maintain a smaller, more thermally stable size while still providing comprehensive connectivity through the distributed pin arrangement.
Data Source
AI summary
A packaging substrate, a packaging structure, an electronic device and a manufacturing method, and pertain to the field of chip packaging technologies. The packaging substrate includes a body including metal cabling. The body includes a first surface, a second surface and a side surface. The side surface is connected to the first surface and second surface. The first surface includes many first connection structures. The second surface includes second connection structures. The side surface includes third connection structures. A part of the first connection structures are connected to the second connection structures by using the metal cabling. The other part of the first connection structures are connected to the third connection structures by using the metal cabling. When the same total quantity of pins need to be disposed, a part of the pins are transferred to the side surface of the body, with less pins at the second surface.