Substrate Side Wire Patterning for Uniform Conductive Edge Lines
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Solution Overview
Problem
Existing methods for forming conductive lines on the side surfaces of substrates, such as in Micro LED display technology, often result in nonuniform thickness and are prone to breakage due to the large aspect ratio and small width of the side surfaces, making it difficult to form reliable connections using processes like photolithography.
Innovation Solution
A method involving the formation of first pattern structures on the side surface using a self-assembly material ink, followed by the deposition of a conductive material film and subsequent removal of the pattern structures, leaving a conductive side wire with improved uniformity and integrity, utilizing processes like local sputtering or metal paste printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography process is used to form line on side surface, then manufacturing process is standard and controllable, but it is not suitable due to large aspect ratio and small width of side surface
Solution Approach 1:
The patent transitions from traditional planar photolithography to a self-assembly approach where colloidal microspheres form patterns on the side surface through spontaneous organization. This dimensional change allows the formation of conductive lines on high aspect ratio surfaces that are inaccessible to conventional top-down lithography methods, solving the applicability issue while maintaining precision through controlled self-assembly.
Solution Approach 2:
The colloidal microspheres perform self-assembly to form the pattern structures automatically without requiring complex photolithography equipment or processes. The microspheres spontaneously organize into ordered arrays on the side surface, eliminating the need for standard photolithography while achieving the desired line patterns, thus resolving the contradiction between precision and manufacturability.
2Ease of manufacture
If conventional method is used to form conductive line on side surface, then process is simple, but the line has nonuniform thickness and is prone to breakage
Solution Approach 1:
The patent uses colloidal microspheres as segmented building blocks that self-assemble into pattern structures. These microspheres serve as discrete units that can be precisely positioned and controlled, allowing the formation of conductive lines with uniform thickness. The segmented approach enables better control over line geometry compared to conventional methods, improving reliability while maintaining process simplicity.
Solution Approach 2:
The patent controls the self-assembly process by adjusting parameters such as microsphere diameter, concentration, and drying conditions. By optimizing these parameters, the method achieves uniform line thickness and improved structural integrity. The parameter control allows precise tuning of the conductive line properties, resolving the contradiction between simple processing and high reliability.
3Manufacturing precision
If self-assembly material ink is used to form pattern structures, then uniform thickness is achieved, but additional processing steps are required
Solution Approach 1:
The patent extracts and removes the pattern structures after they have served their purpose as templates for conductive material deposition. By taking out the sacrificial pattern structures, the method achieves clean conductive lines without the complexity of in-situ formation, while the self-assembly step provides the necessary thickness uniformity. This extraction approach balances precision requirements with process manageability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a side wire with uniform thickness and enhanced reliability, reducing the likelihood of breakage and improving the overall performance of the substrate structure by ensuring better connectivity and structural integrity.
Implementation Method 1
Removing the first solvent in the predetermined ink to cause the self-assembly material to combine into a unitary structure so as to obtain the plurality of first pattern structures
Implementation Method 2
Evaporating the first solvent to cause the colloidal microspheres to be attached to the substrate
Implementation Method 3
forming a conductive material film covering the side surface of the substrate by using a process of local sputtering or a process of printing a metal paste
Data Source
AI summary
A method for manufacturing a side wire for a substrate and a substrate structure are provided. The method includes: forming a plurality of first pattern structures on a side surface of the substrate, wherein a gap between any adjacent two of the plurality of first pattern structures connects a top surface and a bottom surface of the substrate to each other; forming a conductive material film covering the side surface of the substrate; and removing the plurality of first pattern structures and a portion of the conductive material film that is attached on the plurality of first pattern structures, and maintaining a portion of the conductive material film that is located between any adjacent two of the plurality of first pattern structures as the side wire.