Substrate Signal Coupling Circuit With Shielded Reference Metal Surfaces
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Solution Overview
Problem
Signal transmission between substrates through intermediate boards is prone to interference and signal energy loss due to structural composition, leading to reduced signal quality.
Innovation Solution
A signal transmission circuit design that incorporates reference metal surfaces and connection holes around conductors to reduce signal energy leakage by electromagnetic coupling, utilizing first and second substrates with conductors surrounded by reference metal surfaces and connection holes to enhance signal blocking effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signals are transmitted through an intermediate board, then signal transmission between substrates is facilitated, but signal energy loss increases due to interference from the intermediate board's structural composition
Solution Approach 1:
The patent extracts the signal transmission function from the intermediate board structure by using magnetic coupling between conductors on adjacent substrates. This eliminates the need for conductive connection holes and traces in the intermediate board that cause signal interference and energy loss, while still achieving signal transmission between substrates.
Solution Approach 2:
The patent introduces magnetic field coupling as an intermediary mechanism for signal transmission. Instead of direct electrical connection through the intermediate board, signals are transmitted via magnetic coupling between conductors, with the intermediate board serving only as a mechanical support structure.
2Reliability
If external signal transmission lines are used to connect substrates, then signal transmission between substrates is achieved, but interference during signal transmission increases and extra space is required
Solution Approach 1:
The patent removes external signal transmission lines and their associated interference problems by implementing direct magnetic coupling between conductors on adjacent substrates. The signal transmission function is extracted from external pathways and integrated into the substrate structure itself.
Solution Approach 2:
The patent replaces the mechanical electrical connection system (external transmission lines, connection holes, traces) with a magnetic field-based transmission system. This substitution eliminates the physical pathways that are susceptible to interference while maintaining signal transmission capability.
3Reliability
If conductive connection holes and traces in the intermediate board are used, then electrical connection between substrates is established, but signal energy leakage occurs due to the structural composition of the intermediate board
Solution Approach 1:
The patent extracts the signal transmission path from the intermediate board's conductive structures (connection holes and traces) by using magnetic coupling between conductors. This eliminates the sources of signal energy leakage inherent in the intermediate board's electrical connection structures.
Solution Approach 2:
The patent uses magnetic field coupling as an intermediary to transfer signals between substrates without requiring direct electrical connection through the intermediate board. This mediates the connection in a way that avoids energy leakage through the board's conductive structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces signal energy leakage, improving signal concentration and quality by minimizing energy loss, as evidenced by lower insertion loss and better signal transmission characteristics.
Implementation Method 1
signals are wirelessly transmitted between the first substrate and the second substrate through electromagnetic coupling between the first conductor and the second conductor
Implementation Method 2
the leakage of the signal energy when signals are wirelessly transmitted between the first conductor and the second conductor can be reduced through a signal blocking effect provided by the first reference metal surface, the first connection holes, the second reference metal surface, and the second connection holes
Data Source
AI summary
The disclosure provides a signal transmission circuit between substrates, which includes a first substrate and a second substrate. The first substrate comprises a first conductor, a first reference metal surface and a plurality of first connection holes. The first reference metal surface surrounds the periphery of the first conductor. The first connection holes are provided in the body of the first substrate and connected to the first reference metal surface. The second substrate comprises a second conductor, a second reference metal surface, and a plurality of second connection holes. The second reference metal surface surrounds the periphery of the second conductor. The second connection holes are provided in the body of the second substrate and connected to the second reference metal surface. Signals are wirelessly transmitted between the first substrate and the second substrate through an electromagnetic coupling between the first conductor and the second conductor.