Substrate Singulation via Multi-Stage Breaking and Variable Holding Forces
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Solution Overview
Problem
Current methods for separating substrates, such as direct copper bonding substrates, face challenges including surface damage, contamination, and high tool wear during mechanical breaking or sawing, which are time-consuming and costly.
Innovation Solution
An arrangement and method involving a support surface with multiple holding and breaking devices that apply forces to partially separate substrates in a controlled manner, allowing for simultaneous breaking processes without the need to re-grasp or flip the substrate card, thereby minimizing damage and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical breaking is used to separate substrates, then separation is achieved, but surface damage and contamination occur
Solution Approach 1:
The substrate card is divided into multiple individual substrates through controlled breaking at predefined fracture edges. The breaking process is segmented into multiple stages with different holding forces applied to different regions, allowing clean separation without damaging the substrate surfaces.
Solution Approach 2:
The holding force parameter is varied across different regions of the substrate card during the breaking process. The first holding device applies a first holding force to a first region while the second holding device applies a second holding force to a second region, enabling controlled fracture without surface damage.
2Manufacturing precision
If sawing is used to separate substrates, then separation is achieved, but tool wear increases and processing time extends
Solution Approach 1:
The mechanical sawing process is replaced with a breaking mechanism that uses controlled mechanical stress to separate substrates along predefined fracture edges. This substitution eliminates the need for rotating saw blades, reducing tool wear and processing time while maintaining separation precision.
3Productivity
If multiple breaking operations are performed with repositioning, then complete separation is achieved, but handling damage risk increases
Solution Approach 1:
Multiple breaking operations are merged into a single integrated process. The substrate card remains held by the holding devices throughout the entire breaking process, with multiple breaking devices acting simultaneously or sequentially on different regions, eliminating the need for repositioning and reducing handling damage risk.
Solution Approach 2:
The holding force is maintained continuously on the substrate card throughout the entire breaking process. The first and second holding devices maintain their respective holding forces while the breaking devices perform separation, ensuring the substrate card remains stable and prevents falling or unintended breakage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces surface damage, contamination, and tool wear, while significantly reducing the time and cost associated with substrate separation by enabling multiple breaking processes in a single device without repositioning the substrate card.
Implementation Method 1
The first holding device is configured to exert a first holding force on a first holding area of the substrate card during the first breaking operation
Implementation Method 2
The first breaking device is configured to exert a first breaking force on a first breaking area of the substrate card during the first breaking operation in order to partially singulate the substrate card
Implementation Method 3
The second holding device is designed to exert a second holding force on a second holding area of the substrate card during the second breaking operation
Implementation Method 4
The second breaking device is designed to exert a second breaking force on a second breaking area of the substrate card during the second breaking operation in order to further separate the substrate card
Data Source
Figure 1~2B
Figure 3~4B
Figure 5A~7
AI summary
An arrangement for singulating substrates has a support surface configured to receive a substrate card with a first surface and a second surface opposite the first surface, such that the substrate card rests at least partially on the support surface with its second surface. The arrangement further comprises a first holding device and a first breaking device. The first holding device is configured to hold a substrate card arranged on the support surface during a first breaking operation. The first holding device is further configured to exert a first holding force on a first holding area of the substrate card during the first breaking operation. The first breaking device is configured to exert a first breaking force on a first breaking area of the substrate card during the first breaking operation in order to partially singulate the substrate card.The arrangement further comprises a second holding device and a second breaking device. The second holding device is designed to hold the substrate card, which is partially separated after the first breaking operation, on the support surface during a second breaking operation. The second holding device is further designed to exert a second holding force on a second holding area of the substrate card during the second breaking operation. The second breaking device is designed to exert a second breaking force on a second breaking area of the substrate card during the second breaking operation in order to further separate the substrate card.