Power Module Substrate With Slit Insulation For Uniform Current
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Solution Overview
Problem
In electric power modules, the non-uniform application of electric current to semiconductor elements leads to inefficiencies, as existing configurations result in varying current densities across the semiconductor elements, hindering optimal module performance.
Innovation Solution
A substrate structure with slit insulation portions that redirect the electric current path, ensuring uniform current distribution across semiconductor elements by guiding the current through a center region, thereby maintaining consistent density across all elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor elements are arranged in integrated-type power modules to reduce size, then module compactness is improved, but electric current density becomes non-uniform across the semiconductor elements
Solution Approach 1:
The substrate is segmented into multiple element regions (first, second, third, and fourth element regions) with a center region in between. Slit insulation portions are strategically placed between adjacent element regions to divide and control current paths, ensuring uniform current distribution across all semiconductor elements while maintaining compact integrated structure
Solution Approach 2:
A center region is introduced as an intermediary between adjacent element regions. This center region acts as a mediator to redirect and balance current flow, preventing direct current paths that would cause non-uniform density and ensuring equal current distribution to all semiconductor elements
2Manufacturing precision
If slit insulation portions are added to redirect current paths, then current density uniformity is improved, but substrate structural complexity increases
Solution Approach 1:
The substrate is segmented into multiple element regions (first, second, third, and fourth element regions) with a center region in between. Slit insulation portions are strategically placed between adjacent element regions to divide and control current paths, ensuring uniform current distribution across all semiconductor elements while maintaining compact integrated structure
Solution Approach 2:
Multiple slit insulation portions (first, second, third, and fourth slit insulation portions) are merged into a unified substrate structure that collectively redirects current paths. This integrated approach achieves uniform current distribution without requiring separate complex control mechanisms for each insulation portion
Data Source
AI summary
A structure of a substrate is provided for application in an electric power module. The substrate includes element regions, on which a plurality of semiconductor elements are arranged, a center region that defines a space among the element regions, an input terminal region, on which an input terminal for applying an electric current to the substrate is disposed, and one or more slit insulation portions that are defined to face toward sides, respectively, of the element regions adjacent to the input terminal region, which are among the element regions. The slit insulation portions extend toward the center region in such a manner that an electric current applied through the input terminal region flows into the center region.