Substrate Structure With Solid Conductive Pillars for Fine-Pitch Contacts
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Solution Overview
Problem
Conventional semiconductor packaging technologies face challenges in achieving fine line spacing and high-density contacts due to large conductive pillar sizes and voids caused by mechanical drilling, which limits the number of contacts per unit area and increases manufacturing costs.
Innovation Solution
A substrate structure featuring a single solid conductive pillar with adjustable end surfaces, encapsulated by a glass-fiber-free dielectric insulator, and electroplated wiring layers that allow for reduced pillar size and increased circuit area, enabling fine line spacing and high-density contacts without the limitations of traditional drilling methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional mechanical drilling is used to form through holes, then the manufacturing process is simple, but the aperture must be relatively large resulting in large conductive pillar end surfaces
Solution Approach 1:
The patent replaces traditional mechanical drilling with a chemical etching process using KOH solution to form through holes. This substitution allows for precise control of hole dimensions and shape without the mechanical constraints of drilling, enabling smaller aperture and conductive pillar end surfaces while maintaining manufacturing feasibility
Solution Approach 2:
The patent changes the etching parameters (KOH concentration, etching time, temperature) to precisely control the through hole aperture and shape. By adjusting these parameters, the hole diameter can be reduced to achieve smaller conductive pillar end surfaces, directly resolving the contradiction between manufacturing simplicity and pillar size reduction
2Ease of manufacture
If through holes with large aperture are formed by mechanical drilling, then the manufacturing is easier, but the distance between conductive pillars is large reducing contact density
Solution Approach 1:
The patent replaces mechanical drilling with chemical etching using KOH solution, which allows for precise control of hole spacing and size. This enables smaller hole apertures and closer pillar spacing, thereby increasing the number of contacts per unit area while keeping the manufacturing process relatively simple through chemical means
3Stability of the object's composition
If through holes with certain aspect ratio are formed by mechanical drilling, then the hole structure is stable, but uniform copper plating and smooth filling are difficult causing voids
Solution Approach 1:
The patent replaces mechanical drilling with chemical etching to form through holes with optimized aspect ratios and smooth internal surfaces. The chemical etching process creates holes with more favorable geometry for subsequent copper plating and adhesive filling, eliminating the void formation issues associated with mechanically drilled holes while maintaining structural stability
Solution Approach 2:
The patent optimizes the etching parameters (KOH concentration, temperature, time) to control the through hole's aspect ratio and internal surface characteristics. By adjusting these parameters, the hole geometry is optimized to enable uniform copper plating and smooth adhesive filling, preventing void formation while maintaining hole structural integrity
4Strength
If dielectric material containing glass fiber is used for core layer, then the material strength is sufficient, but mechanical drilling is limited requiring large aperture through holes
Solution Approach 1:
The patent replaces mechanical drilling with chemical etching using KOH solution, which is not constrained by the glass fiber content in the dielectric material. This substitution allows for precise control of hole aperture size independent of material strength requirements, enabling smaller through holes while maintaining core layer integrity through the chemical process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a significant reduction in conductive pillar size, increasing contact density and reducing manufacturing costs by allowing uniform copper plating and eliminating voids, thus facilitating the formation of high-density circuit lines.
Implementation Method 1
a copper material 100a is electroplated in the through hole
Data Source
AI summary
A substrate structure is provided, in which an insulator encapsulates a conductive pillar that is a single solid pillar body, and at least one wiring layer electrically connected to the conductive pillar is arranged on the insulator. Therefore, the conductive pillar is designed as a single solid pillar body to meet the requirements of thin lines, fine spacing and high-density contacts.