Substrate Solution Recovery Layout With Static Charge Discharge
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Solution Overview
Problem
Contaminants such as particles, organic residues, and metal residues on semiconductor substrate surfaces affect the characteristics and production yield, and existing cleaning processes struggle to effectively recover and manage processing solutions during semiconductor manufacturing.
Innovation Solution
A substrate processing apparatus is designed with a rotary actuator, multiple recovery containers, insulating and conductive pipes, and static electricity eliminators to efficiently recover and manage processing solutions, including a system for electrostatic charge discharge and ground potential provision, enhancing the reliability of the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If processing solutions are recovered using conventional piping systems, then solution recovery is achieved, but electrostatic charge accumulation occurs causing reliability issues
Solution Approach 1:
The patent converts the harmful electrostatic charge accumulation into a beneficial grounding system. By intentionally providing ground connections through conductive elements in the recovery containers and piping system, the accumulated electrostatic charges are safely discharged to ground, transforming the harmful effect into a controlled electrical management system that protects the semiconductor manufacturing equipment.
Solution Approach 2:
The patent introduces conductive elements and grounding paths as intermediary components between the insulating recovery containers and the ground. These intermediaries (conductive plates, grounding wires, conductive seals) facilitate the discharge of electrostatic charges without compromising the primary function of the recovery system, thereby resolving the reliability issue caused by charge accumulation.
2Productivity
If multiple recovery containers are used to improve solution recovery efficiency, then recovery effectiveness increases, but system complexity increases
Solution Approach 1:
The patent employs a nested arrangement where the first recovery container is positioned inside the second recovery container. This nested configuration allows multiple recovery functions to be integrated in a compact space, improving solution recovery efficiency while minimizing the increase in system complexity through spatial optimization.
Solution Approach 2:
The patent divides the recovery system into multiple functional segments (first recovery container for primary recovery, second recovery container for secondary recovery). This segmentation allows different types of processing solutions to be recovered separately, improving overall recovery efficiency while maintaining manageable system complexity through modular design.
3Object-affected harmful factors
If insulating materials are used in pipes, then contamination is reduced, but electrostatic charge accumulation occurs
Solution Approach 1:
The patent converts the harmful electrostatic charge generated by insulating materials into a manageable electrical phenomenon by implementing a grounding system. The insulating pipes continue to provide contamination-free solution transport, while the grounding paths through conductive elements safely discharge accumulated charges, transforming the harmful effect into a controlled system feature.
Solution Approach 2:
The patent applies different material properties to different parts of the system: insulating materials are used in the pipes for contamination control, while conductive elements are strategically placed at specific locations (recovery containers, connection points) for electrostatic charge management. This local differentiation of material qualities allows simultaneous achievement of both contamination reduction and electrostatic control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively recovers and manages processing solutions, reducing contamination and improving the reliability of semiconductor manufacturing by efficiently handling and recycling cleaning agents, rinse agents, and organic solvents, while preventing electrostatic interference.
Implementation Method 1
a first static electricity eliminator configured to remove electrostatic charges generated by the first pipe
Data Source
AI summary
There is provided a substrate processing apparatus. The substrate processing apparatus may include a substrate supporter supporting a substrate, a processing solution feeder supplying a processing solution to the substrate, first and second recovery containers configured to recover the processing solution, a first pipe connected to the first recovery container and including an insulating material, a second pipe connected to the second recovery container and including an insulating material, a first static electricity eliminator in contact with the first pipe, a second static electricity eliminator in contact with the second pipe, and a plurality of first conductive lines connected to the first and second static electricity eliminators.