Substrate Spectral Inspection for Fast Weak-Point Detection
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in quickly and precisely identifying weak points on substrates due to their high integration and complex structures, particularly with line widths less than 20 nm, which affects yield and quality.
Innovation Solution
A spectral microscopic inspection (SMI)-based method that radiates light onto a substrate, extracts spectra from reflected light, generates distribution maps, and analyzes these spectra in units of entire substrates, shots, and chips to identify weak points, using both vertical and oblique optical systems for high-resolution and large-area inspections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection methods are used on highly integrated substrates with fine patterns, then the manufacturing process can be maintained, but the ability to quickly and precisely identify weak points deteriorates
Solution Approach 1:
The substrate is divided into multiple measurement regions, and spectra are extracted and analyzed in units of entire substrates, shots, chips, and blocks. This segmentation allows precise identification of weak points in specific regions without requiring complete inspection of the entire substrate at full resolution, thereby reducing inspection time while maintaining detection precision.
Solution Approach 2:
The invention introduces spectral dimension by extracting and analyzing spectra representing light intensity according to wavelength. This adds a new dimension to the inspection process, enabling precise weak point detection through spectral characteristics rather than relying solely on spatial resolution, thus improving measurement precision without proportionally increasing inspection time.
2Measurement precision
If high-resolution profile measurement technology is used for fine patterns, then measurement precision improves, but device complexity and inspection time increase
Solution Approach 1:
The invention replaces complex mechanical profiling systems with optical spectrum analysis. By radiating light onto the substrate and analyzing the reflected light spectra, the system achieves high-precision measurement of fine patterns without requiring complex mechanical scanning or contact-based profiling equipment, thereby reducing device complexity while maintaining measurement precision.
Solution Approach 2:
The invention changes the measurement parameter from spatial/profile data to spectral data. Instead of measuring physical dimensions directly, the system measures light intensity according to wavelength and analyzes spectral characteristics to identify weak points. This parameter change enables precise measurement of fine patterns with simpler equipment.
3Reliability
If comprehensive substrate inspection is performed to ensure quality, then manufacturing quality improves, but inspection speed decreases
Solution Approach 1:
The invention extracts spectra from reflected light and identifies weak points by analyzing spectral characteristics rather than performing comprehensive spatial scanning. This extraction approach focuses inspection on identifying problematic regions through their spectral signatures, ensuring quality control while significantly improving inspection speed compared to exhaustive examination methods.
Solution Approach 2:
The system performs preliminary spectrum extraction and analysis across the substrate, identifying weak points before final inspection stages. By using spectrum distribution maps to locate potential issues early, the system ensures thorough quality control while maintaining high inspection speed, as the preliminary spectral analysis covers the entire substrate efficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid and precise detection of weak points, improving substrate yield by reducing defects and enhancing the accuracy of semiconductor manufacturing processes.
Implementation Method 1
extracting a spectrum representing an intensity of light according to a wavelength from a reflected light reflected from the substrate
Data Source
AI summary
A substrate inspection method includes radiating light onto a substrate, extracting a spectrum representing an intensity of light according to a wavelength from a light reflected from the substrate, analyzing the extracted spectrum in units of each of an entire substrate, a shot, a chip, and a block, generating a spectrum distribution map indicating reflectivity for each wavelength band by using the analyzed spectrum, and extracting a weak point in the substrate based on the spectrum distribution map.