Film Deposition Apparatus Substrate Rotation Mechanism
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Solution Overview
Problem
Conventional film deposition apparatuses face challenges in achieving uniform film thickness due to gas flow imbalances and temperature distributions within the vacuum chamber, particularly because the tray rotation mechanism is complex and external, leading to uneven film deposition on substrates.
Innovation Solution
A film deposition apparatus with a rotatable turntable and a substrate supporting member that can be spun relative to the turntable using a drive mechanism and control unit, allowing for precise control of the substrate's position and angle to improve film thickness uniformity without the need for an external spinning device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an external driving apparatus is used to rotate the tray, then the substrate can be spun to improve film thickness uniformity, but the device structure becomes complicated
Solution Approach 1:
The substrate supporting member is designed to rotate automatically by utilizing the relative motion between itself and the turntable during the film deposition process. The protruding portion on the substrate supporting member engages with the recessed portion on the turntable, converting the turntable's rotational movement into substrate rotation without requiring any additional external driving mechanism. This self-service approach eliminates complex external driving apparatus while achieving the desired substrate spinning for uniform film thickness.
Solution Approach 2:
The invention merges the substrate rotation function with the existing turntable motion. By integrating the protruding portion and recessed portion coupling mechanism, the substrate supporting member's rotation is combined with the turntable's orbital motion, allowing both functions to be achieved through a single integrated system rather than separate mechanisms.
2Productivity
If the turntable performs circular motion around its revolving shaft, then substrates can be processed, but film thickness becomes uneven due to gas flow and temperature distribution
Solution Approach 1:
The invention introduces dynamic rotation of the substrate relative to the turntable's circular motion. The substrate supporting member rotates in the same direction as the turntable's circular motion, creating a combined rotational effect. This dynamic adjustment allows the substrate to experience more uniform gas flow and temperature distribution during film deposition, improving film thickness evenness while maintaining processing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures even film thickness by allowing the substrate to spin relative to the turntable, simplifying the structure and improving film uniformity, thus addressing the complexity of conventional systems.
Implementation Method 1
a film deposition apparatus which sequentially supplies at least two reaction gases, which mutually react, into a chamber to deposit a film on a substrate
Implementation Method 2
unbalance in the thickness of a film depositing on the substrate depending on a gas flow inside the vacuum chamber
Data Source
AI summary
A film deposition apparatus for sequentially supplying reaction gases, which mutually react, into a chamber to deposit a film on a substrate includes a turntable rotatable and including a concave portion on an upper surface, a bottom portion of the concave portion having a through hole, a substrate supporting member attachable to and detachable from the concave portion, an upper surface of the substrate supporting member mounting the substrate, a lower surface of the substrate supporting member having a first protruding portion, a drive mechanism moving up and down the turntable and revolving the turntable, a lid member located lower than the turntable, an upper surface of the lid member having a second protruding portion, and a control unit revolving the turntable to cause the first protruding portion to contact the second protruding portion and cause the substrate supporting member to be spun a predetermined angle relative to the turntable.