Steam Pressure Feedback in Substrate Processing for Stable SPM Heating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In existing substrate processing techniques, it is difficult to stabilize the temperature of the processing liquid during sulfuric acid hydrogen peroxide mixture (SPM) treatment due to the challenge of directly measuring the steam discharge flow rate, leading to unstable process performance.
Innovation Solution
A substrate processing apparatus with a control unit that adjusts the steam pressure to a preset value using a pressure gauge and stabilizing mechanism, ensuring consistent temperature of the processing liquid by mixing sulfuric acid and hydrogen peroxide with steam, thereby stabilizing the process performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If steam is supplied to heat the processing liquid, then the temperature of the processing liquid increases, but the temperature becomes unstable due to inability to directly measure steam discharge flow rate
Solution Approach 1:
The patent introduces steam pressure as an intermediary parameter to indirectly control and monitor the steam discharge flow rate. By measuring and controlling steam pressure in the supply line, the system can stabilize the amount of steam supplied to the processing liquid, thereby maintaining stable processing liquid temperature and process performance without directly measuring the discharge flow rate
Solution Approach 2:
The patent implements a feedback control mechanism where steam pressure is continuously monitored and used to adjust the steam supply. The control unit receives steam pressure information and adjusts the steam supply amount accordingly, creating a closed-loop system that maintains stable steam discharge and consequently stable processing liquid temperature
2Productivity
If steam supply amount is increased to improve heating efficiency, then temperature control becomes more difficult without direct flow rate measurement
Solution Approach 1:
The patent changes the control parameter from direct steam flow rate measurement to steam pressure measurement. By controlling steam pressure as a surrogate parameter, the system achieves both high heating efficiency (through adequate steam supply) and precise temperature control (through pressure-based feedback regulation)
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves stable process performance by accurately controlling the temperature of the mixed fluid, efficiently removing resist films from substrates with improved consistency and reliability.
Implementation Method 1
a steam generator 101 that generates steam
Implementation Method 2
The stabilizing mechanism 110 stabilizes an amount of steam supplied from the steam generator 101 to the supply line 48
Implementation Method 3
The pressure adjustment mechanism 104 adjusts the pressure of steam flowing through the supply line 48
Data Source
AI summary
A substrate processing apparatus includes: a holding unit that holds a substrate; a liquid discharge unit; a first supply unit; a second supply unit; and a control unit that controls each unit. The liquid discharge unit discharges a processing liquid to the substrate held by the holding unit. The first supply unit supplies the processing liquid to the liquid discharge unit. The second supply unit supplies steam to the liquid discharge unit. The second supply unit includes: a steam generator that generates steam; a supply line; a stabilizing mechanism; a pressure gauge that measures a pressure of the steam flowing through the supply line; and a pressure adjustment mechanism. The control unit controls the pressure adjustment mechanism so that the pressure of the steam measured by the pressure gauge becomes a preset pressure.