Substrate Stack Alignment Openings for Precise Beam Path Registration

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Solution Overview

Problem

The alignment of substrates in a stack within multi-beam charged particle apparatuses is critical for maintaining high throughput and image quality during inspection and lithography processes, but misalignment can cause aberrations and degrade image quality.

Innovation Solution

A method and system for determining the relative alignment of substrates in a stack by using alignment openings with varying diameters and light beams to establish precise positional relationships, allowing for accurate alignment of substrates and PCB supports.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If alignment openings of the same diameter are used in all substrates, then the structure is simple and manufacturing is easy, but alignment precision cannot be determined for individual substrates

Engineering Contradiction:
Improvealignment precisionVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by making each substrate have at least one alignment opening with a unique diameter that differs from other substrates. This local differentiation in opening diameter allows the system to identify and measure the alignment of each specific substrate individually, while the overall structure remains relatively simple with only one varying parameter (diameter) across the stack.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If multiple alignment parameters are measured simultaneously, then comprehensive alignment assessment is achieved, but the measurement system becomes more complex

Engineering Contradiction:
Improvealignment assessment completenessVSAvoidmeasurement system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent uses the diameter dimension of alignment openings as an additional identifier dimension. By varying the diameter (a dimensional parameter) of openings in different substrates, the system can track and measure alignment across multiple substrates simultaneously using a single light beam path, avoiding the need for complex multi-beam or multi-sensor systems.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the alignment precision of substrates, reducing aberrations and improving image quality and throughput in multi-beam inspection and lithography processes.

Implementation Method 1

each substrate in the substrate stack comprises at least one alignment opening set; the at least one alignment opening set in each substrate is aligned for a light beam to pass through corresponding alignment openings in each substrate

Methodology Applied
Scientific EffectLight transmission: Light

Data Source

PatentUS12476075B2Stack alignment techniques
Publication Date: 2025.11.18 ASML NETHERLANDS BV
  • US12476075B2 patent drawing
  • US12476075B2 patent drawing
  • US12476075B2 patent drawing

AI summary

Disclosed herein is a substrate stack comprising a plurality of substrates, wherein: each substrate in the substrate stack comprises at least one alignment opening set; the at least one alignment opening set in each substrate is aligned for a light beam to pass through corresponding alignment openings in each substrate; and each substrate comprises at least one alignment opening that has a smaller diameter than the corresponding alignment openings in the other substrates.