Substrate Stacking Alignment Under Deformation During Bonding
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Solution Overview
Problem
Existing substrate stacking techniques often result in misalignment of circuits due to differences in deformation between substrates during the stacking process, leading to inefficiencies and defects in layered semiconductor devices.
Innovation Solution
A substrate stacking apparatus and method that form a contact region between two substrates, allowing for controlled expansion of the bonding area while accounting for differences in deformation, using a restricting section to prevent misalignment, and employing a pre-aligner and aligner with precise alignment and activation mechanisms to ensure accurate bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If contact region expands by releasing holding of the first substrate, then bonding area increases, but misalignment occurs due to deformation in multiple directions
Solution Approach 1:
The patent applies preliminary action by pre-heating the first substrate before stacking to anticipate and compensate for thermal deformation that will occur during the stacking process. This preliminary thermal treatment ensures that the substrate is in a stable thermal state when bonding occurs, preventing misalignment caused by subsequent cooling and contraction.
Solution Approach 2:
The patent changes the temperature parameter of the first substrate by heating it to a predetermined temperature before stacking. This parameter change compensates for thermal contraction that would otherwise occur during cooling, maintaining alignment precision between substrates throughout the stacking process and preventing circuit misalignment.
Data Source
AI summary
A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus incudes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.