Substrate Stacking Alignment Using Selectable Correction Holders
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Solution Overview
Problem
There is a need for improved precision in the alignment of substrates during the stacking process in semiconductor device manufacturing, as existing methods fail to effectively correct positional misalignment between substrates, leading to potential electrical connection issues and reduced joining strength.
Innovation Solution
A stacking apparatus and method that utilize a plurality of holding members with different correction capabilities to align and stack substrates, where each holding member corrects positional misalignment by preset amounts, selecting the appropriate holder based on substrate information to ensure precise alignment and minimize misalignment between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional stacking methods are used, then the stacking process is simple, but the alignment precision between substrates deteriorates
Solution Approach 1:
The holding members are segmented into multiple types, each with different correction capabilities for positional misalignment. This segmentation allows the system to handle different alignment requirements by selecting the appropriate holding member type, thereby improving alignment precision without requiring a completely complex new system.
Solution Approach 2:
The system dynamically selects the appropriate holding member based on the measured positional misalignment between substrates. This dynamic adaptation allows the stacking process to adjust to varying alignment requirements, improving precision while maintaining reasonable process complexity through automated selection.
2Manufacturing precision
If holding members with different correction amounts are used, then positional misalignment correction is improved, but the number of holding member types increases
Solution Approach 1:
Different holding members are designed with specific local qualities - each type has a predetermined correction amount tailored to specific misalignment scenarios. This local quality approach allows the system to optimize correction for different situations without requiring every possible correction amount to be available in every holding member.
Solution Approach 2:
The system changes the parameter of correction amount by selecting different holding member types. Each holding member type is characterized by a specific correction amount parameter, and the system adjusts this parameter by selecting the appropriate holding member based on the measured misalignment, thereby achieving precise correction without needing a single complex adjustable mechanism.
3Reliability
If precise alignment is achieved through multiple holding members, then electrical connection reliability is improved, but the selection and management process becomes more complex
Solution Approach 1:
The system performs self-service by automatically measuring the positional misalignment between substrates and selecting the appropriate holding member type based on the measured values. This automated selection process eliminates the need for manual judgment and selection, thereby improving electrical connection reliability through consistent precise alignment while maintaining ease of operation through automation.
Solution Approach 2:
The system uses feedback from the measurement of positional misalignment to determine which holding member type to select. This feedback loop ensures that the correct holding member is chosen based on actual conditions, improving reliability by ensuring precise alignment while simplifying operation through automated decision-making based on measured parameters.
Data Source
AI summary
A stacking apparatus that stacks substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of bolding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position here the holding member is housed to a position where the first substrate is held.