Multi-Layer Substrate Stacking for High-Density Interconnection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing of multi-layer circuit boards is challenging due to difficulties in arranging electronic elements between multiple circuit layers, limiting their application despite advantages in assembly density, signal transmission rate, and electromagnetic interference control.
Innovation Solution
An electronic device comprising three substrates stacked sequentially, with each substrate having its own trace layer and line space, where the second substrate's trace width and line space are narrower than those of the first and third substrates, and including a resilient substrate with redistribution wiring and thin thickness, allowing for flexible arrangement of components and high-density interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multi-layer circuit board is manufactured, then assembly density and signal transmission rate are improved, but manufacturing difficulty increases and arrangement of electronic elements becomes complex
Solution Approach 1:
The multi-layer circuit board is divided into multiple independent substrates (first substrate, second substrate, third substrate) that can be manufactured separately and then assembled together. Each substrate has its own trace layer and can be processed independently, simplifying the manufacturing process while maintaining high assembly density through vertical stacking.
Solution Approach 2:
The patent transitions from planar arrangement of circuit layers to three-dimensional vertical stacking of substrates. By arranging substrates in the vertical dimension (first substrate, second substrate, third substrate stacked sequentially), the design achieves high assembly density without increasing planar complexity, making manufacturing and element arrangement more manageable.
2Productivity
If trace width and line space are reduced for fine-line circuits, then circuit density is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies different trace widths and line spaces to different substrates based on their specific functions. The second substrate has narrower trace width and line space for high-density interconnection, while first and third substrates have wider dimensions for component mounting and signal routing. This localized optimization achieves fine-line circuits where needed without uniformly increasing manufacturing precision requirements across all substrates.
Data Source
AI summary
An electronic device is provided. The electronic device includes a first substrate, a second substrate and a third substrate. The first substrate has a first trace layer, which defines a first trace width. The second substrate has a second trace layer and stacked under the first substrate. The second substrate defines a first surface connecting to the first substrate and a second surface opposite to the first surface. The second trace layer is formed on either or both of the first and second surfaces and defines a second trace width. The third substrate is stacked under the second substrate and connected to the second surface. The third substrate has a third trace layer, which defines a third trace width. At least a partial of the second trace width is no greater than both of the first trace width and the third trace width.