Substrate Layer Stacking with Simultaneous Photo-Curing
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Solution Overview
Problem
Conventional substrate processing methods for forming a spin on carbon (SOC) layer, spin on glass (SOG) layer, and photoresist layer are inefficient, requiring multiple repetitive steps and increasing power consumption and apparatus size due to the sequential formation of each layer, which includes firing and ultraviolet light irradiation processes.
Innovation Solution
A method involving the application of a first coating liquid containing an organic material and a first photo-crosslinking agent to form a first layer, followed by a second coating liquid with a silicon material and a second photo-crosslinking agent to form a second layer, and simultaneous curing of both layers through light irradiation, thereby simplifying the formation of a stacked structure including an organic layer, a silicon layer, and a photoresist layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If each layer (SOC layer, SOG layer, photoresist layer) is formed by repetitive sequential operations including firing and ultraviolet light irradiation, then each layer can be properly formed with required properties, but the number of processing steps increases and power consumption increases
Solution Approach 1:
The patent combines multiple layers (SOC layer and SOG layer) into a single coating step by formulating a multi-component coating liquid that contains both organic material and silicon material. This merging eliminates the need for separate coating operations and reduces the number of firing steps required, as both layers can be formed and cured simultaneously in one firing process.
Solution Approach 2:
The coating liquid is designed to perform multiple functions: it simultaneously forms both the SOC layer and SOG layer, provides adhesion promotion through the organic layer, and enables subsequent photoresist formation. The multi-functional coating liquid eliminates the need for separate coating steps for each layer, reducing process complexity while maintaining layer quality.
2Reliability
If multiple layers are formed by sequential coating and curing operations, then each layer achieves proper curing and properties, but the apparatus size increases and power consumption increases due to multiple firing processes
Solution Approach 1:
The patent merges multiple curing operations into a single firing process. The coating liquid contains both organic material (for SOC layer) and silicon material (for SOG layer), which are simultaneously cured in one firing step. This eliminates the need for separate firing operations for each layer, reducing power consumption while ensuring complete curing of all layers.
Solution Approach 2:
The firing process continuously cures both the organic layer and silicon layer simultaneously rather than alternating between separate curing operations. This continuous multi-layer curing reduces the total number of heating cycles required, thereby reducing energy consumption while maintaining curing completeness.
3Manufacturing precision
If separate coating steps are used for SOC layer and SOG layer, then each layer can be optimized independently, but the number of coating steps increases and processing time increases
Solution Approach 1:
The patent combines the coating steps for SOC layer and SOG layer into a single coating operation. The coating liquid contains both organic material and silicon material in specific proportions, allowing both layers to be deposited simultaneously. This merging maintains the ability to control layer properties through material composition while dramatically reducing the number of coating steps and increasing processing speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of processing steps and minimizes power consumption by curing both layers simultaneously, optimizing the substrate processing method and apparatus for power saving and downsizing.
Implementation Method 1
a light irradiation step of irradiating a stacked body formed of the first layer and the second layer with light, curing the first layer through a crosslinking reaction to form the organic layer, and curing the second layer through a crosslinking reaction to form the silicon layer
Data Source
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AI summary
A substrate processing method includes a first layer (101) generation step of applying a first coating liquid containing an organic material and a first photo-crosslinking agent onto a substrate to form a first layer (101), a second layer (102) generation step of applying a second coating liquid containing a silicon material and a second photo-crosslinking agent onto the first layer (101) to generate a second layer (102), and a light irradiation step of irradiating a stacked body formed of the first layer (101) and the second layer (102) with light, curing the first layer (101) through a crosslinking reaction to form the organic layer, and curing the second layer (102) through a crosslinking reaction to form the silicon layer (106).