Substrate Stage Temperature Correction via Bimetal Flow Control
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Solution Overview
Problem
Existing substrate processing apparatuses require a long time to correct temperature variations caused by external factors due to the heating unit's location outside the mounting table, leading to delayed temperature stabilization.
Innovation Solution
A stage with a heat exchange medium system featuring adjustable flow passages using bimetal structures and rotating annular plates to adjust conductance based on temperature, allowing for rapid temperature correction by altering the flow rate of the heat exchange medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the heating unit is installed outside the mounting table, then the device complexity is reduced, but the temperature correction time increases
Solution Approach 1:
The heating unit is nested inside the mounting table structure, with heating elements positioned within the table's internal cavities. This nesting approach maintains a compact overall device complexity while enabling direct thermal coupling with the substrate mounting surface, significantly reducing temperature correction time compared to external heating configurations.
Solution Approach 2:
The heating system transitions from external surface heating to internal volumetric heating by placing heating elements within the mounting table's three-dimensional structure. This dimensional change allows heat to be applied from multiple internal surfaces simultaneously, reducing the thermal path length and accelerating temperature correction without increasing external device complexity.
2Manufacturing precision
If individual temperature control of coolant is implemented, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The coolant system is segmented into multiple independent flow channels, each with its own temperature control capability. This segmentation allows individual temperature adjustment of different coolant streams to achieve precise substrate temperature control across the mounting table surface, while the modular channel design keeps the overall device complexity manageable through systematic repetition of standardized components.
Solution Approach 2:
Different regions of the mounting table are provided with coolant channels having locally optimized temperature characteristics. By adjusting the temperature of coolant in specific local regions independently, the system achieves high manufacturing precision for temperature control, matching the thermal requirements of different substrate areas without requiring complex global control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid temperature correction of the substrate processing stage in response to external factors, ensuring the stage reaches the target temperature within a short period without external control.
Implementation Method 1
a plurality of adjusting mechanisms provided in the respective flow passages and configured to be deformed depending on a temperature of the heat exchange medium in the respective flow passages
Implementation Method 2
a plate having a top surface on which a substrate is mounted and a bottom surface; a plurality of first tubes extending toward different regions of the bottom surface
Data Source
AI summary
A stage includes a plate having a top surface on which a substrate is to be placed and a bottom surface; a plurality of first tubes each extending toward different regions of the bottom surface and providing opening ends facing the bottom surface; a partition wall defining a plurality of spaces surrounding the respective first tubes, the spaces forming a plurality of flow passages through which a heat exchange medium discharged from the first tubes flows; and a plurality of second tubes connected to the partition wall to communicate with the respective flow passages. The stage further includes a plurality of adjusting mechanisms provided in the respective flow passages. Each of the adjusting mechanisms is configured to be deformed depending on the temperature of the heat exchange medium in the corresponding flow passage to adjust the conductance of the flow passage in accordance with the temperature.