Substrate Stage Cooling Cycle for Stable Low-Temperature Processing
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Solution Overview
Problem
Existing substrate processing methods face challenges in achieving uniform cooling of substrates to extremely low temperatures in ultra-high vacuum environments, leading to non-uniform processing and reduced throughput due to the time required for the stage to reach a stable cooling temperature.
Innovation Solution
A method involving a cooler in direct contact with the stage, where the cooler is moved away to allow natural temperature rise or forced heating, enabling continuous processing at a steady cooling temperature, thus optimizing the cooling process and reducing temperature stabilization time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the stage is cooled to an extremely low temperature by bringing the cooler into direct contact with the stage, then the substrate can be cooled to the required temperature for high magnetoresistance ratio, but the stage requires a long time to reach thermal equilibrium and stable cooling temperature
Solution Approach 1:
The stage is preheated to a predetermined temperature before substrate processing. This preliminary heating action reduces the thermal shock and stabilization time when the cooler is subsequently applied, allowing the stage to reach the steady cooling temperature faster and enabling continuous processing of multiple substrates.
Solution Approach 2:
The cooler is periodically brought into contact with the stage for cooling, then moved away to allow the stage temperature to rise naturally or through forced heating. This periodic cycling between cooling and heating phases enables the stage to reach a steady cooling temperature more quickly, reducing the time required for thermal equilibrium while maintaining effective substrate cooling.
2Manufacturing precision
If the stage is cooled to extremely low temperature for uniform substrate cooling, then processing uniformity is improved, but the throughput is reduced due to the time required for temperature stabilization
Solution Approach 1:
The stage is preheated before the cooling process begins. This preliminary action creates a more controlled thermal environment that accelerates the stabilization process, allowing the stage to reach the steady cooling temperature faster while maintaining uniform cooling across the substrate, thus improving both processing uniformity and throughput.
Solution Approach 2:
The system dynamically adjusts the cooling process by periodically moving the cooler away from the stage to allow temperature rise, then bringing it back for cooling. This dynamic approach enables the stage to reach a steady cooling temperature more quickly, improving throughput while maintaining the uniformity required for high-quality substrate processing.
3Temperature
If the cooler remains in direct contact with the stage during processing, then continuous cooling is maintained, but the stage cannot be heated to raise temperature for subsequent substrates
Solution Approach 1:
The cooler is designed to be movable relative to the stage, allowing it to be periodically brought into contact for cooling and then moved away to allow heating. This dynamic configuration provides temperature control flexibility, enabling the stage to be cooled for current substrate processing and then heated for subsequent substrates, thereby improving both temperature adaptability and processing throughput.
Solution Approach 2:
The cooling process is performed periodically rather than continuously. The cooler is brought into contact with the stage for a specified cooling period, then moved away to allow the stage temperature to rise naturally or through forced heating. This periodic action pattern enables flexible temperature control, maintaining cooling effectiveness while allowing temperature adjustment for subsequent processing cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and uniform cooling of substrates, enhancing processing throughput and reducing non-uniformity among substrates by controlling the stage temperature to a steady state without waiting for thermal equilibrium.
Implementation Method 1
cooling the cooler to a target temperature in a state in which the stage is brought into direct contact with the cooler, and cooling the stage to an initial cooling temperature
Implementation Method 2
raising a temperature of the stage
Implementation Method 3
raising a temperature of the stage; controlling the temperature of the stage to a steady cooling temperature when the temperature of the stage reaches the steady cooling temperature
Data Source
AI summary
A method of cooling a substrate by bringing a cooler into direct contact with a stage on which the substrate is placed, and processing the substrate while rotating the stage in a state in which the cooler is moved away from the stage, includes: cooling the cooler to a target temperature in a state in which the stage is brought into direct contact with the cooler, and cooling the stage to an initial cooling temperature; raising a temperature of the stage; controlling the temperature of the stage to a steady cooling temperature when the temperature of the stage reaches the steady cooling temperature; and placing the substrate on the stage kept at the steady cooling temperature, and continuously performing a substrate processing on a plurality of substrates while rotating the stage in a state in which the stage is moved away from the cooler.